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Si3N4 Ceramic substrate

Si3N4 Ceramic substrate

Introduction:

Silicon Nitride (Si<sub>3</sub>N<sub>4</sub>) has very high strength, especially for hot pressed silicon nitride, which is one of the hardest substances in the world. It is extremely resistant to high temperatures, and the strength can be maintained to a high temperature of 1200 °C without falling, until 1900 °C will decompose . We produced the Si<sub>3</sub>N<sub>4</sub> substrates by Hot pressing.

Physical Properties

Material Si<sub>3</sub>N<sub>4</sub>
Structure M6
Method Hot press
 Density(g/cm3) 3.2+/-0.02 g/cm3
Relative Density 99.50%
Hardness 9.0-9.5(Mohns)
Melting point  1900℃
Thermal conductivity (W/m. K)  
15~ 20W/(m·K)
Thermal Expansion (x10-6/oC)  
2.8~3.2×10-6/℃(20~1000℃)
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