Thin Film Substrates
Preparation of ITO Sputtering Target: Hot Isostatic Pressure Method
Abstract: At present, the preparation methods of ITO sputtering target mainly include hot pressing, cold isostatic pressing sintering and hot isostatic pressing. The ITO target prepared by hot isostatic pressing has the highest quality, and its relative density can reach more than 99%. However, it needs expensive equipment, high preparation cost and long cycle. So, what is the hot isostatic pressure method?
Common Sputtering Back Plate Materials and Instructions for Reuse
Abstract: Sputtering targets are divided into panel and back plate. Depending on the material, the sputtering target back plate is also different. At present, the common sputtering target back plate materials are mainly oxygen free copper, molybdenum, stainless steel tubes, indium and other back plate materials. The details are as follows:
Pre Sputtering Time, Power and Water Temperature Control of Sputtering Target
Abstract: So what should we pay attention to in the pre sputtering process? In fact, in the pre sputtering process, we only need to control these three points: time, power and water temperature.
How to Correctly Install Sputtering Target and Precautions?
Abstract: If the sputtering target is not installed correctly or in place, it is likely to lead to miss target or target cracking. Therefore, it is necessary to choose the right installation method. Because of the different equipment manufacturers, the installation methods of the target materials are also different. In general, we should install in strict accordance with the user manual provided by the equipment manufacturer. At the same time, we also need to pay attention to some details in the installation process.
How to Clean the Dust and Dirt on the Surface of Sputtering Target?
Abstract: In the process of using sputtering target, there may be dust or dirt in the target. There may be many reasons, such as not using vacuum packaging, not wearing gloves before use, more dust in storage or use space, etc. So, when we encounter dust or dirt on the target surface, what should we do? How to clean it is safer?
What are the Preparations for Sputtering Target Before Use?
Abstract: Magnetron sputtering is a new type of physical vapor deposition. The electron gun system is used to shoot and focus the electrons on the material to be plated, making the sputtering atoms follow the principle of momentum conversion and fly away from the material with high kinetic energy to the substrate to form a film. This kind of material is called sputtering target. Today, I'd like to talk with you about some preparations before sputtering.
Application and Introduction of Sputtering Target for Optical Devices
Abstract: High purity sputtering target mainly refers to the metal or non-metal sputtering target with purity of 99.9% - 99.9999% (3N-6N). It can be used in the fields of integrated circuit, flat panel display, solar cell, magnetic recording media, optical devices, etc. The sputtering target of optical devices is used for optical coating to change the characteristics of light conduction. So what are the sputtering targets for optical devices?
Application and Introduction of Sputtering Target for Solar Thin Film Battery
Abstract: Sputtering target material is the raw material for preparing sputtering deposited films. It can be used in integrated circuit, flat panel display, solar cell, information storage, optical devices and other fields. Among them, the sputtering target material for solar thin film battery is the sputtering target material used to form the back electric level of solar thin film battery.
Application and Introduction of Sputtering Target for Flat Panel Display
Abstract: Sputtering target has a wide range of applications. The industries with a large amount of sputtering targets are mainly concentrated in the fields of integrated circuit, flat panel display, solar cell, magnetic recording media, optical devices, etc.
Application and Introduction of Sputtering Target for Semiconductor Chip
Abstract: Semiconductor chips have high technical requirements and high prices for sputtered targets. Their requirements for the purity and technology of sputtered targets are higher than those of flat panel displays, solar cells and other applications. Semiconductor chips set extremely strict standards for the purity of sputtering target metal materials, internal microstructure and other aspects. If the impurity content of sputtering target is too high, the film formed can't meet the electrical performance required by use, and in the sputtering process, it is easy to form particles on the wafer, resulting in short circuit or damage of the circuit, which will seriously affect the performance of the film. Generally speaking, the chip manufacturing requires the highest purity of sputtering target meta
Cerium Hexaboride Sputtering Target Video (CeB6)
Abstract: Cerium Hexaboride Sputtering Target.Brand: AEM Deposition Purity: 99.5%. Size: Dia 2 inch, THICK 6 mm.
Lanthanum Hexaboride Sputtering Target Video (LaB6)
Abstract: Lanthanum Hexaboride Sputtering Target.Brand: AEM Deposition.Purity: 99.5%. Size:Dia 2 inch, THICK 6 mm