Thin Film Substrate
The target bonding methods are recommended for sputtering targets/ Indium bonding vs elastomer bondin
Keywords: Indium bonding, elastomer bonding, sputtering target, backing plate
Abstract: Most sputtering targets can be Indium bonded, because indium bonding has lot of advantages for good thermal conductivity and the backing plate can be reused.While, AEM recommended using elastomer bonding for some targets which is fragile, sensitive to temperature and has low density, such as Tin oxide (SnO2) and some lithium battery materials targets.
DC Sputtering VS RF Sputtering
Keywords: DC sputtering, RF sputtering, thin film materials, sputtering targets
Abstract: What's the difference between DC sputtering and RF sputtering. DC sputtering is a simple technique and suitable for conductive materials only. DC sputtering has a wider range of application and is suitable for all the materials for conductive and non-conductive materials.
Lost Art - Powder Metallurgy
Keywords: powder metallurgy, metal powder
Abstract: Powder metallurgy was formerly known as lost art. Not like clay or other stoneware materials, the skills in molding and firing useful and ornamental metallic objects were seldom applied in the early phases of history.
Copper Powder: High Thermal And Electrical Conductivity!
Keywords: copper powder
Abstract: Chile and China are the world's largest manufacturer of copper powder. AEM ISO 9001 Certified, 10+ Years Experience to Manufacture copper matel powder and copper based alloy powder.
Differences between PVD and Electroplating
Keywords: pvd, electroplating
Abstract: AEM Deposition shares differences between PVD and electroplating for all of you.
How Do Sputtering Targets Work?
Keywords: sputtering targets
Abstract: AEM Deposition shows you how do sputtering targets work.