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  • Aluminum Sputtering Targets (Al)

    Aluminum Sputtering Targets (Al)

    Purity: 99.999%

    Size: 2" diameter x 0.25" thickness

    Price: $60/pc

  • Chromium Sputtering Targets (Cr)

    Chromium Sputtering Targets (Cr)

    Purity: 99.95%

    Size: 2" diameter x 0.25" thickness

    Price: $70/pc

  • Copper Sputtering Targets (Cu)

    Copper Sputtering Targets (Cu)

    Purity: 99.999%

    Size: 2" diameter x 0.25" thickness

    Price: $60/pc

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    Nickel (Ni) Starter Slug Video

    Nickel (Ni) Starter Slug Video

    Nickel slug, Ni Slug, AEM Deposition,Purity: 99.995%,Size: Φ1.48"x 0.67" height, with 15 degree taper

    Quartz Tube (SiO2) Video

    Quartz Tube (SiO2) Video

    Quartz Tube (SiO2), AEM Deposition, Customized Size As per drawings Application: Laboratory use

    Pyrolytic Boron Nitride Crucible video

    Pyrolytic Boron Nitride Crucible video

    Brand: AEM Deposition.Purity: 99.9945%. Size: EX-D: 83 mm, ID: 62.5 mm L:120 mm, Thick: 0.8+/-0.1 mm

    Is there any particular procedure I need to follow before using the sputtering?

    Most ceramic targets benefit from being bonded to a backing plate to increase target cooling. Also, the target must be conditioned before depositing films from it.

    How should I store lithium evaporation pieces?

    To avoid oxidation, lithium should be kept either in oil or an inert argon atmosphere. Unused pieces should be repackaged in the oil with a tight seal and stored in a cool.

    How do I know if the sputtering target I want to purchase requires bonding?

    Our webpages for sputtering targets have bonding recommendations. Please visit the products menu for the required target, and all the recommendations are stated there.

    What is the proper fill rate of a material in an e-beam crucible liner?

    Our recommendation is to fill the crucible between ⅔ and ¾ full. We find that the melting point of a material in the crucible directly affects the crucible liner.

    How to choose the thickness of substrates & wafers?

    The thickness of the wafers is always determined by the automated strength of the used materials, which means the wafer should be thick enough to not crack during handling.