High Purity Materials
Thin Film Substrates
Understanding the Difference: N-Type vs P-Type Semiconductors
Abstract: Do you know what sets N-Type and P-Type Semiconductors apart? This article will delve into these two types of semiconductors to help you understand their differences.
Preparation of Ultrafine Metal Powder by Air Flow Milling
Abstract: Ultrafine metal powder can be prepared by mechanical method and physical methods. Today, check the preparation method of ultra-fine metal powder.
Preparation of Ultrafine Metal Powder by Ball Milling
Abstract: Ultrafine metal powder materials can be widely used in aerospace, ship, automobile, metallurgy, chemical industry, and other fields.
Process Flow of Metal Powder Injection Molding
Abstract: Metal injection molding (MIM) is a kind of molding method in which the plasticized mixture of metal powder and its binder is injected into the mold.
Metal Powder Injection Molding (PIM) is Suitable for Which Type of Industries?
Abstract: The application of metal powder injection molding in the industry can be divided into two categories: civil and military.
Development Trend of Sputtering Target Industry
Abstract: Sputtering target materials have shown a rapid growth momentum in the international and domestic markets, and the era of scale application and industrialization has come.
Development Trend of ITO Sputtering Target
Abstract: with the development of large-scale flat panel displays, the requirements of ITO target size and density are higher and higher.