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Sputtering Targets
Sputtering targets are a physical vapor deposition (PVD) mechanism used to coat substrates with thin films. The process starts by feeding a substrate into a vacuum chamber containing two magnets. After introducing a controlled gas into the chamber.
These atoms then collide with each other in their gaseous state before condensing into a plasma that dries into a thin film on the substrate.
You can check the details information of specific category as below:
Metal sputtering targets are usually made from highly pure metals. They are the most widely used and fundamental coating materials for other sputter deposition technology.
Alloy sputtering targets are materials composed of one metal and other metals or non-metals while still showing the some metallic characteristics.
Oxide sputtering targets with one or more oxides being the main principal components and other minor oxides being the additives.
Sulfide, also spelled sulphide. Sulfide is a quite common material for sputtering targets. A lot of sulfide compounds has unique properties in optical properties.
AEM Deposition manufacturer's a wide variety of sputtering targets. If you don't see the material you're searching for on the list above, please contact us and we would be more than happy to assist you.
We produce high quality, ultra-pure sputtering targets (99.9% to 99.9999%) and other deposition materials for all applications using both vacuum melt/casting and hot isostatic pressing (HIP) technology.
If you're looking for sputtering targets, we'll work with you to find the best option for your needs.
Our company AEM is one of the sputtering targets Manufacturer in China with more than 15+ years experience. Serving more than 90+ country's clients, and help our clents growing with a health way.AEM Deposition has rich experience for all kinds of sputtering targets production, including Pure Metal, Alloy, Oxide, Sulfide, Selenide, Boride, Carbide, Silicide, Telluride, Nitride, Fluoride Targets.
Sputtering is a technology that is used to deposit thin films from a wide variety of materials onto different shapes and sizes of substrates. The process is repeatable and can be used for medium to large batches of substrates.
In sputtering, an inert gas such as Argon is often used to transfer momentum to the target material. For light elements, Neon is also used, and for heavy elements Krypton or Xenon are used. Reactive gases can be used to sputter compounds, and the reaction can occur on the target surface, in-flight, or on the substrate depending on the process parameters.
There are many factors that influence the quality of films grown by sputtering deposition, which is why it is a complex process. However, this also allows experts to have a lot of control over the film's growth and microstructure.
In order to create a thin film with the desired characteristics, a sputtering deposition process is used to fabricate the sputter target.It is important to choose the right material for the target, whether it is one element, a mixture of elements, alloys, or a compound.
The process of choosing the right material and preparing it for sputtering is essential for creating thin films of consistent quality. As our team of engineers and scientists continue to perfect the deposition run parameters, we are able to provide our clients with specialized tailor-made targets for research and development purposes. Our high-purity raw material powders combined with our distinguished standardized microstructure result in superb grain size and quality thin films.
If you have any questions of choose the right sputtering targets, you can contact our sales team directly. Submit the form below and you will get a quote within one working day.
If you're looking for Sputtering targets, we'll work with you to find the best solution for your needs.
