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Sputtering Targets
Metal sputtering targets are usually made from highly pure metals. They are the most widely used and fundamental coating materials for other sputter deposition technology.
Alloy sputtering targets are materials composed of one metal and other metals or non-metals while still showing the some metallic characteristics.
Oxide sputtering targets with one or more oxides being the main principal components and other minor oxides being the additives.
Sulfide, also spelled sulphide. Sulfide is a quite common material for sputtering targets. A lot of sulfide compounds has unique properties in optical properties.
As a senior sputtering targets manufacturer and exporter, AEM Deposition has comprehensive and vast experience for all kinds of sputtering targets production, including Pure Metal, Alloy, Oxide, Sulfide, Selenide, Boride, Carbide, Silicide, Telluride, Nitride, Fluoride Targets. AEM Deposition enjoys a solid reputation for its exceptional performance. We offer each sputtering target ships complete with a certificate of analysis and Safety Data Sheet (SDS).
Sputtering is a proven technology capable of depositing thin films from a wide variety of materials to diverse substrate shapes and sizes. The process is repeatable and can be scaled up from small research and development projects to production batches involving medium to large substrate areas. The sputtering gas is often an inert gas such as Argon. For efficient momentum transfer, projectile mass must match target mass, so for sputtering light elements, Neon is also used, and for heavy elements Krypton or Xenon. Reactive gases are used to sputter compounds. The chemical reaction can occur on the target surface, in-flight, or on the substrate depending on the process parameters. Multiple parameters make sputtering deposition a complex process, but these also allow experts to have a large degree of control over the film's growth and microstructure.
To achieve the desired characteristics in a sputtering deposited thin film. The manufacturing process is used to fabricate the sputter target. It can be critical whether the target material comprises only one element, a mixture of elements, alloys, or perhaps a compound. The process to produce, that defines the material in a suitable form for sputtering, thin films of consistent quality is as essential. As the deposition run parameters perfected by the thin film process engineers and scientists. Providing Special Tailor-Made Targets for our clients to research and development (R & D) is the strong point of AEM Deposition. Superfine grain size and high purity raw material powder based customized products together with the distinguished standardized microstructure. These properties help to achieve a longer life for targets and desired characteristics of the sputtering deposited thin film.
As a senior sputtering target supplier, We also provide in-house Sputtering Target Bonding services, including Indium Metallic Bonding and Epoxy Bonding.
