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AEM Deposition
Titanium Dioxide Sputtering Target (TiO2) Video

Titanium Dioxide Sputtering Target (TiO2) Video

Date: 2020-05-12

Keywords: Titanium,Dioxide,Sputtering,Target,TiO2,Video,Titanium,

Abstract: TiO2 Sputtering Target. Brand: AEM Deposition. Purity: 99.99%. Diameter: Φ40 x 50 mm. Application:• Decorative coating. • Flat Panel Displays. • Low-E Glass industry

Fe2O3 doped HfO2 Sputtering Target Video

Fe2O3 doped HfO2 Sputtering Target Video

Date: 2020-05-08

Keywords: Fe2O3,doped,HfO2,Sputtering,Target,Video,Fe2O3,doped,HfO2,

Abstract: Fe2O3 doped HfO2 Sputtering Target. 6.0 at% Fe2O3 doped HfO2. Brand: AEM Deposition. Purity: 99.95%. Diameter: 1 inch. Thickness: 0.125 inch

HfO2 doped Ta2O5 Sputtering Target Video

HfO2 doped Ta2O5 Sputtering Target Video

Date: 2020-05-08

Keywords: HfO2,doped,Ta2O5,Sputtering,Target,Video,HfO2,doped,Ta2O5,

Abstract: HfO2 doped Ta2O5 Sputtering Target. 6.0 at% HfO2 doped Ta2O5. Brand: AEM Deposition. Purity: 99.95%. Diameter: 1 inch. Thickness: 0.125 inch

Ta2O5 doped HfO2 Sputtering Target Video

Ta2O5 doped HfO2 Sputtering Target Video

Date: 2020-05-08

Keywords: Ta2O5,doped,HfO2,Sputtering,Target,Video,Ta2O5,doped,HfO2,

Abstract: Ta2O5 doped HfO2 Sputtering Target. 6.0 at% Ta2O5 doped HfO2. Brand: AEM Deposition. Purity: 99.95%. Diameter: 1 inch.Thickness: 0.125 inch

Y2O3 doped HfO2 Sputtering Target Video

Y2O3 doped HfO2 Sputtering Target Video

Date: 2020-05-08

Keywords: Y2O3,doped,HfO2,Sputtering,Target,Video,Y2O3,doped,HfO2,

Abstract: Y2O3 doped HfO2 Sputtering Target. 6.0 at% Y2O3 doped HfO2. Brand: AEM Deposition. Purity: 99.95%. Diameter: 1 inch Thickness: 0.125 inch

Tungsten Sputtering Target (W) Video

Tungsten Sputtering Target (W) Video

Date: 2020-05-08

Keywords: Tungsten,Sputtering,Target,Video,Tungsten,Sputtering,Target,

Abstract: Tungsten Sputtering Target. Brand: AEM Deposition. Purity: 99.95%. Diameter: 57 mm. Thickness: 1.5 mm

Titanium Sputtering Target (Ti) Video

Titanium Sputtering Target (Ti) Video

Date: 2020-04-30

Keywords: Titanium,Sputtering,Target,Video,Titanium,Sputtering,Target,

Abstract: Titanium Sputtering Target. Brand: AEM Deposition. Purity: 99.995%. Diameter: 57 mm. Thickness: 1.5 mm

Tantalum Sputtering Target (Ta) Video

Tantalum Sputtering Target (Ta) Video

Date: 2020-04-30

Keywords: Tantalum,Sputtering,Target,Video,Tantalum,Sputtering,Target,

Abstract: Tantalum Sputtering Target. Brand: AEM Deposition. Purity: 99.95%. Diameter: 57 mm. Thickness: 0.1 mm

ITO Sputtering Target (Indium Tin Oxide) Video

ITO Sputtering Target (Indium Tin Oxide) Video

Date: 2020-04-29

Keywords: ITO Sputtering Target

Abstract: ITO Sputtering Target (In2O3/SnO2 90/10 wt%) .Brand: AEM Deposition. Purity: 99.99%. Density: 7.13g/cm3. Size: 200mm x 65mm x 6mm. Indium bonded to a 200mm x 65mm x 1.6mm Cu backing plate.

Molybdenum Crucible (Mo) Video

Molybdenum Crucible (Mo) Video

Date: 2020-04-29

Keywords: Molybdenum,Crucible,Video,

Abstract: Molybdenum Crucible: Purity: 99.5%~99.99%; Surface: Finish turning, polishing; Density: 10.10 g/cm3; Melting Point: 2630℃. Application: Laboratory uses, metallurgy industry, mechanism process industry, crystalloid materials, and other burgeoning high technology industry.

Application of Superfine Copper Powder

Application of Superfine Copper Powder

Date: 2020-04-22

Keywords: Application of Superfine Copper Powder

Abstract: Copper powder is a kind of metal powder with red luster. It can be widely used in powder metallurgy, electric carbon products, electronic materials, metal coatings, chemical catalysts, filters, heat pipes and other mechanical and electrical parts and electronic aviation fields. Superfine copper powder refers to copper powder with smaller particle diameter and finer particle size.

Comparison of DC Sputtering, Magnetron Sputtering and Sputtering Coating

Comparison of DC Sputtering, Magnetron Sputtering and Sputtering Coating

Date: 2020-04-13

Keywords: Comparison of DC Sputtering, Magnetron Sputtering and Sputtering Coating

Abstract: Sputtering is one of the main technologies for the preparation of thin film materials. It uses the ions generated by the ion source to accelerate the aggregation in vacuum, forming a high-speed ion beam flow, bombarding the solid surface, and the ion and the atoms on the solid surface exchange kinetic energy, so that the atoms on the solid surface are separated from the solid and deposited on the substrate surface. There are three sputtering technologies: DC sputtering, sputtering coating and DC magnetron sputtering.