Thin Film Substrates
Application and Introduction of Sputtering Target for Optical Devices
Abstract: High purity sputtering target mainly refers to the metal or non-metal sputtering target with purity of 99.9% - 99.9999% (3N-6N). It can be used in the fields of integrated circuit, flat panel display, solar cell, magnetic recording media, optical devices, etc. The sputtering target of optical devices is used for optical coating to change the characteristics of light conduction. So what are the sputtering targets for optical devices?
Application and Introduction of Sputtering Target for Solar Thin Film Battery
Abstract: Sputtering target material is the raw material for preparing sputtering deposited films. It can be used in integrated circuit, flat panel display, solar cell, information storage, optical devices and other fields. Among them, the sputtering target material for solar thin film battery is the sputtering target material used to form the back electric level of solar thin film battery.
Application and Introduction of Sputtering Target for Flat Panel Display
Abstract: Sputtering target has a wide range of applications. The industries with a large amount of sputtering targets are mainly concentrated in the fields of integrated circuit, flat panel display, solar cell, magnetic recording media, optical devices, etc.
Application and Introduction of Sputtering Target for Semiconductor Chip
Abstract: Semiconductor chips have high technical requirements and high prices for sputtered targets. Their requirements for the purity and technology of sputtered targets are higher than those of flat panel displays, solar cells and other applications. Semiconductor chips set extremely strict standards for the purity of sputtering target metal materials, internal microstructure and other aspects. If the impurity content of sputtering target is too high, the film formed can't meet the electrical performance required by use, and in the sputtering process, it is easy to form particles on the wafer, resulting in short circuit or damage of the circuit, which will seriously affect the performance of the film. Generally speaking, the chip manufacturing requires the highest purity of sputtering target meta
Application Field of Metal Powder Injection Molding Technology
Abstract: Metal powder injection molding technology has the characteristics of high precision, uniform structure, excellent performance and low production cost. It can be widely used in biomedical devices, office equipment, automobile, machinery, hardware, aerospace and other industrial fields. The details are as follows:
Process and Characteristics of Metal Powder Injection Molding Technology
Abstract: MIM (metal powder injection molding) is a new forming technology of powder metallurgy, which is introduced into the field of powder metallurgy.
Classification and Introduction of Powder Coatings
Abstract: In recent years, the development speed of powder coating is quite amazing, and it still keeps about 10% growth under the pressure of the depression of the chemical industry environment. This is closely related to the characteristics and advantages of powder coating. Under the driving force of environmental protection requirements and technological innovation, it also provides enough power for the rapid development of powder coating. So, how is powder coating classified?
Cerium Hexaboride Sputtering Target Video (CeB6)
Abstract: Cerium Hexaboride Sputtering Target.Brand: AEM Deposition Purity: 99.5%. Size: Dia 2 inch, THICK 6 mm.
Lanthanum Hexaboride Sputtering Target Video (LaB6)
Abstract: Lanthanum Hexaboride Sputtering Target.Brand: AEM Deposition.Purity: 99.5%. Size:Dia 2 inch, THICK 6 mm
Principle and Application of Arc Additive Manufacturing
Abstract: When it comes to additive manufacturing, we usually think of laser additive manufacturing technology (3D printing) firstly. In fact, there are other types of metal additive manufacturing technology, which can be divided into four categories according to the type of heat source: laser, electron beam, plasma beam and arc; and two categories according to the type of raw materials: metal powder and metal wire.
Characteristics and Application of Titanium
Abstract: Titanium metal has the characteristics of very high strength, excellent corrosion resistance, difficult to cold work, good weldability, about 40% lighter than steel, 60% heavier than aluminum, low conductivity, low thermal expansion rate, high melting point, etc. High purity titanium can be made into all kinds of pure titanium products. Such as titanium powder, titanium rod, titanium plate, titanium tube and so on. The details are as follows:
Characteristics and Application of Chromium Metal
Abstract: Chromium is often used as a chromium coating. Chromium plating process is generally divided into three types: decorative coating, hard chromium coating and black chromium coating. The decorative chromium coating is usually plated on the outside of the nickel layer as the top layer, and the coating has a delicate polishing effect like a mirror. As a decorative post-treatment process, the thickness of chromium coating is only 0.006 mm. The sputtering targets commonly used for chromium coating are as follows: