How to Clean the Dust and Dirt on the Surface of Sputtering Target?
Date: 2021-01-22
Keywords: How,Clean,the,Dust,and,Dirt,Surface,Sputtering,Target,
Abstract: In the process of using sputtering target, there may be dust or dirt in the target. There may be many reasons, such as not using vacuum packaging, not wearing gloves before use, more dust in storage or use space, etc. So, when we encounter dust or dirt on the target surface, what should we do? How to clean it is safer?
What are the Preparations for Sputtering Target Before Use?
Date: 2021-01-22
Keywords: What,are,the,Preparations,for,Sputtering,Target,Before,Use,
Abstract: Magnetron sputtering is a new type of physical vapor deposition. The electron gun system is used to shoot and focus the electrons on the material to be plated, making the sputtering atoms follow the principle of momentum conversion and fly away from the material with high kinetic energy to the substrate to form a film. This kind of material is called sputtering target. Today, I'd like to talk with you about some preparations before sputtering.
Copper Pellet Evaporation Material Video
Date: 2021-01-22
Keywords: Copper,Pellet,Evaporation,Material,Video,Copper,Pellet,
Abstract: Copper Pellet Evaporation Material.Brand: AEM Deposition Purity: 99.999%.Diameter: 3 mm.Length: 3 mm.Application: Conductor of heat and electricity;Building material;Strain gauges;Thermocouples for temperature measurement.
Gold Pellet Evaporation Material Video
Date: 2021-01-22
Keywords: Gold,Pellet,Evaporation,Material,Video,Gold,Pellet,
Abstract: Gold Pellet Evaporation Material.Brand: AEM Deposition.Purity: 99.99%.Diameter: 3 mm.Length: 4 mm.Application:Conductor of heat and electricity;Semiconductors;Sensors;Batteries.
Application and Introduction of Sputtering Target for Optical Devices
Date: 2021-01-22
Keywords: Application,and,Introduction,Sputtering,Target,for,Optical,
Abstract: High purity sputtering target mainly refers to the metal or non-metal sputtering target with purity of 99.9% - 99.9999% (3N-6N). It can be used in the fields of integrated circuit, flat panel display, solar cell, magnetic recording media, optical devices, etc. The sputtering target of optical devices is used for optical coating to change the characteristics of light conduction. So what are the sputtering targets for optical devices?
Application and Introduction of Sputtering Target for Solar Thin Film Battery
Date: 2021-01-22
Keywords: Application,and,Introduction,Sputtering,Target,for,Solar,
Abstract: Sputtering target material is the raw material for preparing sputtering deposited films. It can be used in integrated circuit, flat panel display, solar cell, information storage, optical devices and other fields. Among them, the sputtering target material for solar thin film battery is the sputtering target material used to form the back electric level of solar thin film battery.
Application and Introduction of Sputtering Target for Flat Panel Display
Date: 2021-01-22
Keywords: Application,and,Introduction,Sputtering,Target,for,Flat,
Abstract: Sputtering target has a wide range of applications. The industries with a large amount of sputtering targets are mainly concentrated in the fields of integrated circuit, flat panel display, solar cell, magnetic recording media, optical devices, etc.
Application and Introduction of Sputtering Target for Semiconductor Chip
Date: 2021-01-22
Keywords: Application,and,Introduction,Sputtering,Target,for,
Abstract: Semiconductor chips have high technical requirements and high prices for sputtered targets. Their requirements for the purity and technology of sputtered targets are higher than those of flat panel displays, solar cells and other applications. Semiconductor chips set extremely strict standards for the purity of sputtering target metal materials, internal microstructure and other aspects. If the impurity content of sputtering target is too high, the film formed can't meet the electrical performance required by use, and in the sputtering process, it is easy to form particles on the wafer, resulting in short circuit or damage of the circuit, which will seriously affect the performance of the film. Generally speaking, the chip manufacturing requires the highest purity of sputtering target meta
Application Field of Metal Powder Injection Molding Technology
Date: 2021-01-22
Keywords: Application,Field,Metal,Powder,Injection,Molding,Technology,
Abstract: Metal powder injection molding technology has the characteristics of high precision, uniform structure, excellent performance and low production cost. It can be widely used in biomedical devices, office equipment, automobile, machinery, hardware, aerospace and other industrial fields. The details are as follows:
Process and Characteristics of Metal Powder Injection Molding Technology
Date: 2021-01-22
Keywords: Process,and,Characteristics,Metal,Powder,Injection,Molding,
Abstract: MIM (metal powder injection molding) is a new forming technology of powder metallurgy, which is introduced into the field of powder metallurgy.
Classification and Introduction of Powder Coatings
Date: 2021-01-22
Keywords: Classification,and,Introduction,Powder,Coatings,recent,
Abstract: In recent years, the development speed of powder coating is quite amazing, and it still keeps about 10% growth under the pressure of the depression of the chemical industry environment. This is closely related to the characteristics and advantages of powder coating. Under the driving force of environmental protection requirements and technological innovation, it also provides enough power for the rapid development of powder coating. So, how is powder coating classified?
Cerium Hexaboride Sputtering Target Video (CeB6)
Date: 2021-01-22
Keywords: Cerium,Hexaboride,Sputtering,Target,Video,CeB6,Cerium,
Abstract: Cerium Hexaboride Sputtering Target.Brand: AEM Deposition Purity: 99.5%. Size: Dia 2 inch, THICK 6 mm.