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Iridium Sputtering Targets (Ir)

Iridium Sputtering Targets (Ir)
Material Type Iridium
Symbol Ir
Atomic Weight 192.217
Atomic Number 77
Color/Appearance Silvery White, Metallic
Thermal Conductivity 150 W/m.K
Melting Point (°C) 2,410
Coefficient of Thermal Expansion 6.4 x 10-6/K
Theoretical Density (g/cc) 22.42
Z Ratio 0.129
Sputter DC
Max Power Density*
(Watts/Square Inch)
100
Type of Bond Indium, Elastomer

General

Iridium is a chemical element with symbol Ir and atomic number 77. A very hard, brittle, silvery-white transition metal of the platinum group, iridium is generally credited with being the second densest element (after osmium). It is also the most corrosion-resistant metal, even at temperatures as high as 2000 ¡ãC. Although only certain molten salts and halogens are corrosive to solid iridium, finely divided iridium dust is much more reactive and can be flammable

Material Notes

Iridium Sputtering Targets, Purity is 99.9%; Circular: Diameter <= 14inch, Thickness >= 1mm; Block: Length <= 32inch, Width <= 12inch, Thickness >= 1mm. Bonding is recommended for these materials. Many materials have characteristics which are not amenable to sputtering, such as, brittleness and low thermal conductivity.This material may require special ramp up and ramp down procedures. This process may not be necessary with other materials. Targets that have a low thermal conductivity are susceptible to thermal shock.
 


Other Information of Iridium Sputtering Targets

Applications
Electronics
• Semiconductor
• Flat panel displays
Features
Competitive pricing
• High purity
• Grain refined, engineered microstructure
• Semiconductor grade

Manufacturing Process
Refining
  Three-layer electrolytic process
• Melting and casting
  Electrical resistance furnace - Semi-continuous casting
• Grain refinement
  Thermomechanical treatment
• Cleaning and final packaging - Cleaned for use in vacuum
  Protection from environmental contaminants
  Protection during shipment
Options
99.999% minimum purity
• Semiconductor grade aluminum alloys available
  Al/Si,Al/Cu,Al/Cu/Si
• Planar circular targets up to 18'' (457mm) diameter
• Planar tiles up to 48'' (1200mm) X 15.75'' (400mm) for larger target configurations
• Smaller sizes also available for R&D applications
• Sputtering target bonding service
 
 
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