High Purity Materials
Thin Film Substrates
Question: How do I know if the sputtering target I want to purchase requires bonding?
Answer:Our webpages for sputtering targets note bonding recommendations. Please visit the product page for the target and the recommendation should be noted there.
Question: What are different target bonding methods?
Answer: Indium Metallic Bonding & Epoxy Bonding
Question: What is the recommended target thickness for a bonded assembly?
Answer: For 2-4" Torus guns the maximum thickness is 1/4", therefore a 1/8" thick target bonded to a 1/8" thick backing plate is the most common configuration.
Question: What are the maximum operating temperatures for indium and elastomer bonds?
Answer: Use 150Â°C for indium bonding and 250Â°C for elastomer bonding.
Question: What type of targets should be bonded?
Answer: Any hot pressed, sintered, or 'hipped' ceramics or metals should be bonded.
Question: Is it better to bond fragile target materials to a backing plate?
Answer: Most oxide, nitride, and silicide targets crack during normal sputtering. Applying (or removing) power to these types of targets, must be done by slowly ramping up / down with occasional 'soaks' to allow the target to recover from thermal stresses. Bonding such targets to a suitable backing plate is highly recommended so the target, once cracked, stays together. A cracked target will still sputtered providing plasma has no line-of-sight access through the cracks to the bonding agent or the backing plate. Bonding the target to a backing plate may or may not allow it to accept higher power. Remember, the characteristics of the bonding agent must now be added tothe heat dissipation considerations.