List of Sputtering Targets for Flat Panel Display Coating

Date: 2021-09-15

Keywords: List,Sputtering,Targets,for,Flat,Panel,Display,Coating,

Abstract: In order to ensure the uniformity of large area film, improve productivity and reduce cost, sputtering technology is more and more used to prepare flat panel display film. The sputtering targets for flat display coating mainly include Cr sputtering target, Mo sputtering target, Al sputtering target, Al alloy sputtering target, Cu sputtering target, Cu alloy sputtering target and ITO sputtering target. The details are as follows:

List of Sputtering Targets for Magnetic Recording Coating

Date: 2021-09-15

Keywords: List,Sputtering,Targets,for,Magnetic,Recording,Coating,The,

Abstract: The sputtering targets used for sputtering film recording include chromium based sputtering targets, cobalt based sputtering targets, cobalt iron sputtering targets, nickel based sputtering targets and other alloy sputtering targets. The details are as follows:

List of Sputtering Targets for Electronic Device Coating

Date: 2021-09-15

Keywords: List,Sputtering,Targets,for,Electronic,Device,Coating,List,

Abstract: Sputtering target can be used for coating electronic devices. Electronic device coating is mainly used for film resistance and film capacitance. The film resistor can provide 10-1000m Ω resistor, and the temperature coefficient of the resistor is small and the stability is good, which can effectively reduce the size of the device. Therefore, sputtering targets are often used.

List of Sputtering Targets for Glass Coating

Date: 2021-09-15

Keywords: List,Sputtering,Targets,for,Glass,Coating,The,application,

Abstract: Correspondingly, the demand of target materials for glass coating is increasing rapidly. The sputtering target materials for glass coating mainly include: silver sputtering target, chromium sputtering target, titanium sputtering target, nickel chromium sputtering target, zinc tin sputtering target, silicon aluminum sputtering target, titanium oxide sputtering target, etc. The details as follows:

List of Sputtering Targets for Coating of Tools and Moulds

Date: 2022-09-15

Keywords: List,Sputtering,Targets,for,Coating,Tools,and,Moulds,The,

Abstract: The main types of sputtering targets for tool mould coating are titanium aluminum sputtering target, chromium aluminum sputtering target, chromium sputtering target, titanium sputtering target, etc. The details are as follows:

List of Sputtering Targets for Decorative Coating

Date: 2021-09-15

Keywords: List,Sputtering,Targets,for,Decorative,Coating,Decorative,

Abstract: The main types of target materials for decorative coating are: chromium sputtering target, titanium sputtering target, zirconium sputtering target, nickel sputtering target, tungsten sputtering target, titanium aluminum sputtering target, etc. The details are as follows:

Preparation of ITO Sputtering Target by Slurry Casting Forming Atmosphere Sintering

Date: 2021-09-15

Keywords: Preparation,ITO,Sputtering,Target,Slurry,Casting,Forming,

Abstract: ITO sputtering target, namely indium tin oxide target, is coated with a transparent and conductive ITO film, on glass substrate or organic film by magnetron sputtering. ITO sputtering target can be prepared by many methods. One of them is the law of sintering in powder casting forming atmosphere.

Preparation of ITO Sputtering Target by Spark Plasma Sintering

Date: 2021-09-15

Keywords: Preparation,ITO,Sputtering,Target,Spark,Plasma,Sintering,

Abstract: ITO sputtering target has high transmittance and low resistivity. High quality ITO films need ITO sputtering target with high density, purity and uniformity. At present, the preparation methods of ITO sputtering target mainly include hot pressing, cold isostatic pressing sintering and hot isostatic pressing. Today, I would like to introduce the spark plasma sintering method.

The Process of ITO Sputtering Target Prepared by Sintering at Atmospheric Pressure

Date: 2021-09-15

Keywords: The,Process,ITO,Sputtering,Target,Prepared,Sintering,ITO,

Abstract: The normal pressure sintering method is to prepare high-density target blank by means of pre pressing (or slurry casting). The target blank is sintered in a certain atmosphere and temperature. Through the control of sintering temperature and sintering atmosphere, the growth of target blank grain is effectively controlled to achieve high densification of target and uniformity of grain distribution.

Preparation of ITO Sputtering Target by Vacuum Hot Pressing

Date: 2021-09-15

Keywords: Preparation,ITO,Sputtering,Target,Vacuum,Hot,Pressing,ITO,

Abstract: The vacuum hot pressing method refers to the molding or isostatic pressing and both forming methods. It uses heat and mechanical energy to densify the target. Because the heating process and pressure process are carried out at the same time, it is helpful for the mass transfer process of powder particles such as diffusion contact and flow in the sintering process. The vacuum hot pressing method has the advantages of shortening the sintering period, reducing the sintering temperature and effectively restraining the grain size of the target material, which can greatly improve the density of the target material.

Preparation of ITO Sputtering Target: Hot Isostatic Pressure Method

Date: 2021-09-15

Keywords: Preparation,ITO,Sputtering,Target,Hot,Isostatic,Pressure,

Abstract: At present, the preparation methods of ITO sputtering target mainly include hot pressing, cold isostatic pressing sintering and hot isostatic pressing. The ITO target prepared by hot isostatic pressing has the highest quality, and its relative density can reach more than 99%. However, it needs expensive equipment, high preparation cost and long cycle. So, what is the hot isostatic pressure method?

Common Sputtering Back Plate Materials and Instructions for Reuse

Date: 2021-09-16

Keywords: Common,Sputtering,Back,Plate,Materials,and,Instructions,for,

Abstract: Sputtering targets are divided into panel and back plate. Depending on the material, the sputtering target back plate is also different. At present, the common sputtering target back plate materials are mainly oxygen free copper, molybdenum, stainless steel tubes, indium and other back plate materials. The details are as follows: