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Palladium Sputtering Targets (Pd)

Palladium Sputtering Targets (Pd)
Material Type Palladium
Symbol Pd
Atomic Weight 106.42
Atomic Number 46
Color/Appearance Silvery White Metallic
Thermal Conductivity 72 W/m.K
Melting Point (°C) 1,554
Coefficient of Thermal Expansion 11.8 x 10-6/K
Theoretical Density (g/cc) 12.02
Z Ratio 0.357
Sputter DC
Max Power Density*
(Watts/Square Inch)
100
Type of Bond Indium, Elastomer
Comments Alloys with refractory metals.

General

Palladium belongs to group 10 in the periodic table, but the configuration in the outermost electron shells is atypical for group 10 (see also niobium (41), ruthenium (44), and rhodium (45)). Fewer electron shells are filled than the elements directly preceding it (a phenomenon unique to palladium). The valence shell has eighteen electrons – ten more than the eight found in the valence shells of the noble gases from neon onward.

Material Notes

Palladium Sputtering Targets, Purity is 99.95%; Circular: Diameter <= 14inch, Thickness >= 1mm; Block: Length <= 32inch, Width <= 12inch, Thickness >= 1mm.
 


Other Information of Palladium Sputtering Targets

Applications
Electronics
• Semiconductor
• Flat panel displays
Features
Competitive pricing
• High purity
• Grain refined, engineered microstructure
• Semiconductor grade

Manufacturing Process
Refining
  Three-layer electrolytic process
• Melting and casting
  Electrical resistance furnace - Semi-continuous casting
• Grain refinement
  Thermomechanical treatment
• Cleaning and final packaging - Cleaned for use in vacuum
  Protection from environmental contaminants
  Protection during shipment
Options
99.95% minimum purity
• Semiconductor grade aluminum alloys available
  Al/Si,Al/Cu,Al/Cu/Si
• Planar circular targets up to 18'' (457mm) diameter
• Planar tiles up to 48'' (1200mm) X 15.75'' (400mm) for larger target configurations
• Smaller sizes also available for R&D applications
• Sputtering target bonding service
 
 
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