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Platinum Sputtering Targets (Pt)

Platinum Sputtering Targets (Pt)
Material Type Platinum
Symbol Pt
Atomic Weight 195.084
Atomic Number 78
Color/Appearance Metallic Gray
Thermal Conductivity 72 W/m.K
Melting Point (°C) 1,772
Coefficient of Thermal Expansion 8.8 x 10-6/K
Theoretical Density (g/cc) 21.45
Z Ratio 0.245
Sputter DC
Max Power Density*
(Watts/Square Inch)
Type of Bond Indium, Elastomer
Comments Alloys with metals. Films soft, poor adhesion. Temperatures required to achieve deposition may not be practical for thermal evaporation.


Pure platinum is a lustrous, ductile, and malleable, silver-white metal. Platinum is more ductile than gold, silver or copper, thus being the most ductile of pure metals, but it is less malleable than gold. The metal has excellent resistance to corrosion, is stable at high temperatures and has stable electrical properties. Platinum reacts with oxygen slowly at very high temperatures. It reacts vigorously with fluorine at 500 ¡ãC (932 ¡ãF) to form platinum tetrafluoride. It is also attacked by chlorine, bromine, iodine, and sulfur. Platinum is insoluble in hydrochloric and nitric acid, but dissolves in hot aqua regia(nitric acid hydrochloride), to form chloroplatinic acid, H2PtC

Material Notes

Platinum Sputtering Targets, Purity is 99.99%; Circular: Diameter <= 14inch, Thickness >= 1mm; Block: Length <= 32inch, Width <= 12inch, Thickness >= 1mm.

Other Information of Platinum Sputtering Targets

• Semiconductor
• Flat panel displays
Competitive pricing
• High purity
• Grain refined, engineered microstructure
• Semiconductor grade

Manufacturing Process
  Three-layer electrolytic process
• Melting and casting
  Electrical resistance furnace - Semi-continuous casting
• Grain refinement
  Thermomechanical treatment
• Cleaning and final packaging - Cleaned for use in vacuum
  Protection from environmental contaminants
  Protection during shipment
99.99% minimum purity
• Semiconductor grade aluminum alloys available
• Planar circular targets up to 18'' (457mm) diameter
• Planar tiles up to 48'' (1200mm) X 15.75'' (400mm) for larger target configurations
• Smaller sizes also available for R&D applications
• Sputtering target bonding service
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