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Rhenium Sputtering Targets (Re)

Rhenium Sputtering Targets (Re)
Material Type Rhenium
Symbol Re
Atomic Weight 186.207
Atomic Number 75
Color/Appearance Grayish White, Metallic
Thermal Conductivity 48 W/m.K
Melting Point (°C) 3,180
Coefficient of Thermal Expansion 6.2 x 10-6/K
Theoretical Density (g/cc) 21.02
Z Ratio 0.15
Sputter DC
Max Power Density*
(Watts/Square Inch)
100
Type of Bond Indium, Elastomer

General

Rhenium is a chemical element with symbol Re and atomic number 75. It is a silvery-white, heavy, third-row transition metal in group 7 of the periodic table. With an estimated average concentration of 1 part per billion (ppb), rhenium is one of the rarest elements in the Earth's crust. The free element has the third-highest melting point and highest boiling point of any element at 5873 K. Rhenium resembles manganese and technetium chemically and is mainly obtained as a by-product of the extraction and refinement of molybdenum and copper ores. Rhenium shows in its compounds a wide variety of oxidation states ranging from ?1 to +7.

Material Notes

Rhenium Sputtering Targets, Purity is 99.9%;Circular: Diameter <= 14inch, Thickness >= 1mm; Block: Length <= 32inch, Width <= 12inch, Thickness >= 1mm.
 


Other Information of Rhenium Sputtering Targets

Applications
Electronics
• Semiconductor
• Flat panel displays
Features
Competitive pricing
• High purity
• Grain refined, engineered microstructure
• Semiconductor grade

Manufacturing Process
Refining
  Three-layer electrolytic process
• Melting and casting
  Electrical resistance furnace - Semi-continuous casting
• Grain refinement
  Thermomechanical treatment
• Cleaning and final packaging - Cleaned for use in vacuum
  Protection from environmental contaminants
  Protection during shipment
Options
99.999% minimum purity
• Semiconductor grade aluminum alloys available
  Al/Si,Al/Cu,Al/Cu/Si
• Planar circular targets up to 18'' (457mm) diameter
• Planar tiles up to 48'' (1200mm) X 15.75'' (400mm) for larger target configurations
• Smaller sizes also available for R&D applications
• Sputtering target bonding service
 
 
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