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Selenium Sputtering Targets (Se)

Selenium Sputtering Targets (Se)
Material Type Selenium
Symbol Se
Atomic Weight 78.96
Atomic Number 34
Color/Appearance Gray, Metallic Luster, Non-Metallic
Thermal Conductivity 0.52 W/m.K
Melting Point (°C) 217
Theoretical Density (g/cc) 4.81
Z Ratio 0.864
UN Number 3283
Comments Bad for vacuum systems. High V.P. Low Melting Point materials not ideal for sputtering.


Selenium forms several allotropes that interconvert with temperature changes, depending somewhat on the rate of temperature change. When prepared in chemical reactions, selenium is usually an amorphous, brick-red powder. When rapidly melted, it forms the black, vitreous form, usually sold commercially as beads.The structure of black selenium is irregular and complex and consists of polymeric rings with up to 1000 atoms per ring. Black Se is a brittle, lustrous solid that is slightly soluble in CS2. Upon heating, it softens at 50 ¡ãC and converts to gray selenium at 180  ; the transformation temperature is reduced by presence of halogens and amin.

Material Notes

Selenium Sputtering Targets, Purity is 99.999- 99.9999%;Circular: Diameter <= 14inch, Thickness >= 1mm; Block: Length <= 32inch, Width <= 12inch, Thickness >= 1mm. Some materials and manufacturing methods may yield product with higher than average porosity. Performance may be affected according to process requirements.

Other Information of Selenium Sputtering Targets

• Semiconductor
• Flat panel displays
Competitive pricing
• High purity
• Grain refined, engineered microstructure
• Semiconductor grade

Manufacturing Process
  Three-layer electrolytic process
• Melting and casting
  Electrical resistance furnace - Semi-continuous casting
• Grain refinement
  Thermomechanical treatment
• Cleaning and final packaging - Cleaned for use in vacuum
  Protection from environmental contaminants
  Protection during shipment
99.999% minimum purity
• Semiconductor grade aluminum alloys available
• Planar circular targets up to 18'' (457mm) diameter
• Planar tiles up to 48'' (1200mm) X 15.75'' (400mm) for larger target configurations
• Smaller sizes also available for R&D applications
• Sputtering target bonding service
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