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  • Development Trend of ITO Sputtering Target

    In recent years, with the development of large-scale flat panel display, the requirements of ITO target size and density are higher and higher, and hot pressing equipment and technology are far from meeting their requirements. Therefore, the production of large-scale and high-density ITO targets by sintering process has become the focus of research and development of major target manufacturers in China. After a long time of development, the quality and cost of LCD products have been improved and the requirements for ITO target materials have been improved.
     
    At present, the development of LCD, PDP, OLED and other display technologies requires the improvement of ITO target quality and cost reduction, so ITO target presents the following development trend.
     
    1) Large size
    With the continuous development of the trend of light and low price of liquid crystal module products, the corresponding ITO glass substrate also has an obvious trend of large-scale, so the large-scale ITO target single-chip size is inevitable. In order to meet the technological requirements of large-area coating, advanced technology enterprises adopt large-scale targets to reduce the number of splicing joints of targets and improve efficiency and quality. This is mainly because the gap between the targets destroys the directional movement of the electrons on the target surface, and it is easy to gather a large number of charges in the gap, which is easy to cause the discharge phenomenon of the target, resulting in the early blackening of the target. The blackening of the target will cause many problems, such as the increase of the surface resistance, the increase of the film thickness, the decrease of the transmittance, the decrease of the sputtering rate, the increase of the conductive power and the increase of the voltage.
     
    2) Low resistivity
    With the development trend of LCD's more and more refinement and its different drivers, transparent conductive film with smaller resistivity is needed, ITO target performance is required to be improved, sputtering technology and equipment are required to be improved. At present, the ITO film resistance formed by ITO target has reached below 1.1 × 10-4 Ω· cm at the base temperature of 350 ℃, while the ITO film for high-end LCD requires lower resistance.
     
    3) High density
    Density, as the most important technical index of ITO target, directly affects the use efficiency of target and the quality of ITO film. If low density target is used, the effective sputtering area will be reduced, the sputtering speed will also be reduced, the use cycle of target will be shortened, resulting in the increase of cost and the decline of ITO film quality. If high density target is used, the surface change will be small, the film quality will be high, and the use cycle will be long.
     
    4) Target body integration
    As mentioned before, the target material will develop towards a large area. In the past, when the technical capacity is insufficient, multiple targets must be used to weld into a large area. However, due to the degradation of coating quality caused by the joint, most of the targets are formed as a whole to improve the coating quality and utilization rate. In the future, the increasing size of new generation LCD glass substrate is a severe challenge to target manufacturers.
     
    5) Increase usage
    Improving the sputtering efficiency of ITO target has been one of the hot and difficult issues in this field. The efficiency of planar ITO sputtering target is about 20-25%, while the efficiency of non planar ITO sputtering target can be increased to 40%~60%。 At present, target manufacturers are actively researching and developing rotary ITO target and tubular ITO target. The research and application of this technology is bound to bring new technological innovation to ITO industry.
     
    AEM Deposition, as a sputtering target supplier and manufacturer in China, can provide all kinds of pure metal sputtering targets, alloy sputtering targets, ceramic compound sputtering targets and other targets. See the following list for details:
     
    Pure Metal Sputtering Target Alloy Sputtering Target Oxide Sputtering Target Sulfide Sputtering Target
    Boride Sputtering Target Carbide Sputtering Target Silicide Sputtering Target
    Telluride Sputtering Target Nitride Sputtering Target Fluoride Sputtering Target  

    If you need ITO sputtering target or other related sputtering targets, you can go to the sputtering target product page for more details. You can also email us directly for consultation. E-mail: [email protected]
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