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Terbium Oxide Sputtering Targets (Tb4O7)

Terbium Oxide Sputtering Targets (Tb4O7)
Material Type Terbium Oxide
Symbol Tb4O7
Color/Appearance Brown
Melting Point (°C) Decomposes to Tb2O3
Density  7900 kg/m-3
Molecular Weight 747.69
Exact Mass 174.92 g/mol


Tb4Ois most often produced by ignition of the oxalate at or the sulfate in air. The oxalate (at 1000 °C) is generally preferred, since the sulfate requires a higher temperature, and it produces an almost black product contaminated with Tb6O11 or other oxygen-rich oxides. AEM can produce high purity Terbium Oxide sputtering targets with the highest possible density and smallest possible average grain sizes in applications.

Material Notes

Terbium Oxide Sputtering Target, Purity is 99.99%; Circular: Diameter <= 14inch, Thickness >= 1mm; Block: Length <= 32inch, Width <= 12inch, Thickness >= 1mm.


Other Information of Terbium Oxide Sputtering Targets

• Chemical vapor deposition (CVD) and physical vapor deposition (PVD) 

• For CMOS

• High purity
• Custom Sizes Available

Manufacturing Process
• Manufacturing - Cold pressed - Sintered, Elastomer bonded to backing plate

• Cleaning and final packaging, Cleaned for use in vacuum,
Protection from environmental contaminants
Protection during shipment

99.9% ex Strontium Minimum Purity

•Up to 12'' Diameter Targets Available

•Planar Tiles Up to 8'' X 5'' for Larger Target Configurations

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