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Terbium Oxide Sputtering Targets (Tb4O7)

Terbium Oxide Sputtering Targets (Tb4O7)
Material Type Terbium Oxide
Symbol Tb4O7
Color/Appearance Brown
Melting Point (°C) Decomposes to Tb2O3
Density  7900 kg/m-3
Molecular Weight 747.69
Sputter  
Exact Mass 174.92 g/mol


General

Tb4Ois most often produced by ignition of the oxalate at or the sulfate in air. The oxalate (at 1000 °C) is generally preferred, since the sulfate requires a higher temperature, and it produces an almost black product contaminated with Tb6O11 or other oxygen-rich oxides. AEM can produce high purity Terbium Oxide sputtering targets with the highest possible density and smallest possible average grain sizes in applications.

Material Notes

Terbium Oxide Sputtering Target, Purity is 99.99%; Circular: Diameter <= 14inch, Thickness >= 1mm; Block: Length <= 32inch, Width <= 12inch, Thickness >= 1mm.


 


Other Information of Terbium Oxide Sputtering Targets

Applications
  Ferroelectric
• Chemical vapor deposition (CVD) and physical vapor deposition (PVD) 

• For CMOS

Features
• High purity
• Custom Sizes Available

Manufacturing Process
• Manufacturing - Cold pressed - Sintered, Elastomer bonded to backing plate

• Cleaning and final packaging, Cleaned for use in vacuum,
Protection from environmental contaminants
Protection during shipment

Options
99.9% ex Strontium Minimum Purity

•Up to 12'' Diameter Targets Available

•Planar Tiles Up to 8'' X 5'' for Larger Target Configurations

 
 
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