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AEM Deposition

Terbium Sputtering Targets (Tb)

Terbium Sputtering Targets (Tb)
Terbium Sputtering Targets (Tb)Terbium Sputtering Targets (Tb)
Material Type Terbium
Symbol Tb
Atomic Weight 158.92535
Atomic Number 65
Color/Appearance Silvery White, Metallic
Thermal Conductivity 11 W/m.K
Melting Point (°C) 1,356
Coefficient of Thermal Expansion 10.3 x 10-6/K
Theoretical Density (g/cc) 8.27
Z Ratio 0.66
Sputter RF
UN Number 2813

Terbium Sputtering Target

Terbium is a silvery-white rare earth metal that is malleable, ductile and soft enough to be cut with a knife. It is relatively stable in air compared to the earlier, more reactive lanthanides in the first half of the lanthanide series. Terbium exists in two crystal allotropes with a transformation temperature of 1289 ℃ between them. The 65 electrons of a terbium atom are arranged in the electron configuration [Xe]4f96s2; normally, only three electrons can be removed before the nuclear charge becomes too great to allow further ionization, but in the case of terbium, the stability of the half-filled [Xe]4f7 configuration allows further ionization of a fourth electron in the presence of very strong oxidizing agents such as fluorine gas.

Terbium Sputtering Target Information

Terbium Sputtering Targets
Purity is 99.9%; Circular:
Diameter <= 14inch, Thickness >= 1mm;
Block: Length <= 32inch, Width <= 12inch, Thickness >= 1mm.
Due to the highly reactive nature of these materials, packaging in oil is required to reduce the opportunity for oxidation or other reaction.

Other Information of Terbium Sputtering Target


• Electronics
• Semiconductor
• Flat panel displays


• Competitive pricing
• High purity
• Grain refined, engineered microstructure
• Semiconductor grade

Manufacturing Process

• Refining
  Three-layer electrolytic process
• Melting and casting
  Electrical resistance furnace - Semi-continuous casting
• Grain refinement
  Thermomechanical treatment
• Cleaning and final packaging - Cleaned for use in vacuum
  Protection from environmental contaminants
  Protection during shipment


• 99.9% minimum purity
• Smaller sizes also available for R&D applications
• Sputtering target bonding service

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