Terbium Sputtering Targets (Tb)



Material Type | Terbium |
Symbol | Tb |
Atomic Weight | 158.92535 |
Atomic Number | 65 |
Color/Appearance | Silvery White, Metallic |
Thermal Conductivity | 11 W/m.K |
Melting Point (°C) | 1,356 |
Coefficient of Thermal Expansion | 10.3 x 10-6/K |
Theoretical Density (g/cc) | 8.27 |
Z Ratio | 0.66 |
Sputter | RF |
UN Number | 2813 |
General
Terbium is a silvery-white rare earth metal that is malleable, ductile and soft enough to be cut with a knife. It is relatively stable in air compared to the earlier, more reactive lanthanides in the first half of the lanthanide series. Terbium exists in two crystal allotropes with a transformation temperature of 1289 ℃ between them. The 65 electrons of a terbium atom are arranged in the electron configuration [Xe]4f96s2; normally, only three electrons can be removed before the nuclear charge becomes too great to allow further ionization, but in the case of terbium, the stability of the half-filled [Xe]4f7 configuration allows further ionization of a fourth electron in the presence of very strong oxidizing agents such as fluorine gas.
Material Notes
Terbium Sputtering Targets, Purity is 99.9%; Circular: Diameter <= 14inch, Thickness >= 1mm; Block: Length <= 32inch, Width <= 12inch, Thickness >= 1mm. Due to the highly reactive nature of these materials, packaging in oil is required to reduce the opportunity for oxidation or other reaction.
Other Information of Terbium Sputtering Targets
Applications • Electronics • Semiconductor • Flat panel displays |
Features • Competitive pricing • High purity • Grain refined, engineered microstructure • Semiconductor grade |
Manufacturing Process • Refining Three-layer electrolytic process • Melting and casting Electrical resistance furnace - Semi-continuous casting • Grain refinement Thermomechanical treatment • Cleaning and final packaging - Cleaned for use in vacuum Protection from environmental contaminants Protection during shipment |
Options • 99.999% minimum purity • Semiconductor grade aluminum alloys available Al/Si,Al/Cu,Al/Cu/Si • Planar circular targets up to 18'' (457mm) diameter • Planar tiles up to 48'' (1200mm) X 15.75'' (400mm) for larger target configurations • Smaller sizes also available for R&D applications • Sputtering target bonding service |


