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Terbium Sputtering Targets (Tb)

Terbium Sputtering Targets (Tb)
Material Type Terbium
Symbol Tb
Atomic Weight 158.92535
Atomic Number 65
Color/Appearance Silvery White, Metallic
Thermal Conductivity 11 W/m.K
Melting Point (°C) 1,356
Coefficient of Thermal Expansion 10.3 x 10-6/K
Theoretical Density (g/cc) 8.27
Z Ratio 0.66
Sputter RF
UN Number 2813

General

Terbium is a silvery-white rare earth metal that is malleable, ductile and soft enough to be cut with a knife. It is relatively stable in air compared to the earlier, more reactive lanthanides in the first half of the lanthanide series. Terbium exists in two crystal allotropes with a transformation temperature of 1289 ℃ between them. The 65 electrons of a terbium atom are arranged in the electron configuration [Xe]4f96s2; normally, only three electrons can be removed before the nuclear charge becomes too great to allow further ionization, but in the case of terbium, the stability of the half-filled [Xe]4f7 configuration allows further ionization of a fourth electron in the presence of very strong oxidizing agents such as fluorine gas.

Material Notes

Terbium Sputtering Targets, Purity is 99.9%; Circular: Diameter <= 14inch, Thickness >= 1mm; Block: Length <= 32inch, Width <= 12inch, Thickness >= 1mm. Due to the highly reactive nature of these materials, packaging in oil is required to reduce the opportunity for oxidation or other reaction.
 


Other Information of Terbium Sputtering Targets

Applications
Electronics
• Semiconductor
• Flat panel displays
Features
Competitive pricing
• High purity
• Grain refined, engineered microstructure
• Semiconductor grade

Manufacturing Process
Refining
  Three-layer electrolytic process
• Melting and casting
  Electrical resistance furnace - Semi-continuous casting
• Grain refinement
  Thermomechanical treatment
• Cleaning and final packaging - Cleaned for use in vacuum
  Protection from environmental contaminants
  Protection during shipment
Options
99.999% minimum purity
• Semiconductor grade aluminum alloys available
  Al/Si,Al/Cu,Al/Cu/Si
• Planar circular targets up to 18'' (457mm) diameter
• Planar tiles up to 48'' (1200mm) X 15.75'' (400mm) for larger target configurations
• Smaller sizes also available for R&D applications
• Sputtering target bonding service
 
 
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