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AEM Deposition

Terbium Dysprosium Iron (Terfenol-D) Sputtering Target (Tb0.3/Dy0.7/Fe1.9)

Terbium Dysprosium Iron (Terfenol-D) Sputtering Target (Tb0.3/Dy0.7/Fe1.9)
Terbium Dysprosium Iron (Terfenol-D) Sputtering Target (Tb0.3/Dy0.7/Fe1.9)


Terfenol-D is an alloy comprised of Terbium, Dysprosium and Iron. Terfenol-D has the largest room temperature magnetostriction of any known material. Terfenol-D is a solid-state material capable of converting energy from one form to another. In the case of electrical-to-mechanical conversion, the magnetostriction of the Terfenol-D generates strains 100 times greater than traditional magnetostrictives, and 2-5 times greater than traditional piezoceramics. The material has a high Curie temperature (380℃), which enables magnetostrictive performance greater than 1000 ppm from room temperature to 200¡ãC. Adjustments in alloy composition can extend this range down to cryogenic temperature.

Material Notes

Terbium dysprosium iron (Terfenol-D) Sputtering Targets, Purity is 99.9%; Circular: Diameter <= 14inch, Thickness >= 1mm; Block: Length <= 32inch, Width <= 12inch, Thickness >= 1mm. In addition, TdVib can tailor the Terfenol-D composition to allow for a wider operating temperature range. By adjusting the Tb:Dy ratio large magnetostriction values can be achieved at temperatures as low as -200¡ãC and as high as 200¡.

Other Information of Terbium Dysprosium Iron Sputtering Targets

• Chemical vapor deposition (CVD)
• Physical vapor deposition (PVD) display
Competitive pricing
• High purity
• Grain refined, engineered microstructure
• Semiconductor grade

Manufacturing Process
  Three-layer electrolytic process
• Melting and casting
  Electrical resistance furnace - Semi-continuous casting
• Grain refinement
  Thermomechanical treatment
• Cleaning and final packaging - Cleaned for use in vacuum
  Protection from environmental contaminants
  Protection during shipment
99.9% minimum purity
• Planar circular targets up to 18'' (457mm) diameter
• Planar tiles up to 48'' (1200mm) X 15.75'' (400mm) for larger target configurations
• Smaller sizes also available for R&D applications
• Sputtering target bonding service
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