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Cadmium Sputtering Targets (Cd)

Cadmium Sputtering Targets (Cd)
Material Type Cadmium
Symbol Cd
Atomic Weight 112.411
Atomic Number 48
Color/Appearance Silvery Gray, Metallic
Thermal Conductivity 97 W/m.K
Melting Point (°C) 321
Coefficient of Thermal Expansion 30.8 x 10-6/K
Theoretical Density (g/cc) 8.64
Z Ratio 0.682
Sputter DC, RF
Max Power Density*
(Watts/Square Inch)
30
Type of Bond Indium, Elastomer
UN Number 2570
Comments Bad for vacuum systems. Low sticking coefficient.

General

Cadmium is a chemical element with symbol Cd and atomic number 48. This soft, bluish-white metal is chemically similar to the two other stable metals in group 12, zinc and mercury. Like zinc, it demonstrates oxidation state +2 in most of its compounds, and like mercury, it has a lower melting point than other transition metals. Cadmium and its congeners are not always considered transition metals, in that they do not have partly filled d or f electron shells in the elemental or common oxidation states. The average concentration of cadmium in Earth's crust is between 0.1 and 0.5 parts per million (ppm).

Material Notes

Cadmium Sputtering Targets, Purity is 99.99%;
Circular: Diameter <= 14inch, Thickness >= 1mm;
Block: Length <= 32inch, Width <= 12inch, Thickness >= 1mm.

 


Other Information of Cadmium Sputtering Targets

Applications
Electronics
• Semiconductor
• Flat panel displays
Features
Competitive pricing
• High purity
• Grain refined, engineered microstructure
• Semiconductor grade

Manufacturing Process
Refining
  Three-layer electrolytic process
• Melting and casting
  Electrical resistance furnace - Semi-continuous casting
• Grain refinement
  Thermomechanical treatment
• Cleaning and final packaging - Cleaned for use in vacuum
  Protection from environmental contaminants
  Protection during shipment
Options
99.999% minimum purity
• Semiconductor grade cadmium compound targets
  CdS, CdO, Cd2SnO4, CdTe, CdSe
• Planar circular targets up to 18'' (457mm) diameter
• Planar tiles up to 48'' (1200mm) X 15.75'' (400mm) for larger target configurations
• Smaller sizes also available for R&D applications
• Sputtering target bonding service
 
 
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