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AEM Deposition

Gold Sputtering Targets (Au)

Gold Sputtering Targets (Au)
Gold Sputtering Targets (Au)Gold Sputtering Targets (Au)Gold Sputtering Targets (Au)
Material Type Gold
Symbol Au
Atomic Weight 196.966569
Atomic Number 79
Color/Appearance Gold, Metallic
Thermal Conductivity 320 W/m.K
Melting Point (°C) 1,064
Coefficient of Thermal Expansion 14.2 x 10-6/K
Theoretical Density (g/cc) 19.3
Z Ratio 0.381
Sputter DC
Max Power Density*
(Watts/Square Inch)
Type of Bond Indium, Elastomer
Comments Films soft; not very adherent.

Gold Sputtering Target

Gold is a chemical element with symbol Au (from Latin: aurum) and atomic number 79. In its purest form, it is a bright, slightly reddish yellow, dense, soft, malleable, and ductile metal. Chemically, gold is a transition metal and a group 11 element. It is one of the least reactive chemical elements and is solid under standard conditions. Gold often occurs in free elemental (native) form, as nuggets or grains, in rocks, in veins, and in alluvial deposits. It occurs in a solid solution series with the native element silver (as electrum) and also naturally alloyed with copper and palladium. The gold sputtering targets are common used as semiconductor and optical recording materials.

Gold Sputtering Target Information

Gold Sputtering Targets
Purity: 99.99-99.999%;
Circular: Diameter <= 14inch, Thickness >= 1mm;
Block: Length <= 32inch, Width <= 12inch, Thickness >= 1mm.
Precious Metals Recycling Program.We offer a precious metals recycling program designed to reduce your material costs.

Other Information of Gold Sputtering Target


• Electronics
• Semiconductor
• Flat panel displays


• Competitive pricing
• High purity
• Grain refined, engineered microstructure
• Semiconductor grade

Manufacturing Process

• Refining
  Three-layer electrolytic process
• Melting and casting
  Electrical resistance furnace - Semi-continuous casting
• Grain refinement
  Thermomechanical treatment
• Cleaning and final packaging - Cleaned for use in vacuum
  Protection from environmental contaminants
  Protection during shipment


• 99.99% minimum purity
• Smaller sizes also available for R&D applications
• Sputtering target bonding service

Related Products of Gold Sputtering Target

Ceramic Sputtering Targets
Evaporation Materials
Metal Powders

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