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Gold Sputtering Targets (Au)

Gold Sputtering Targets (Au)
Material Type Gold
Symbol Au
Atomic Weight 196.966569
Atomic Number 79
Color/Appearance Gold, Metallic
Thermal Conductivity 320 W/m.K
Melting Point (°C) 1,064
Coefficient of Thermal Expansion 14.2 x 10-6/K
Theoretical Density (g/cc) 19.3
Z Ratio 0.381
Sputter DC
Max Power Density*
(Watts/Square Inch)
100
Type of Bond Indium, Elastomer
Comments Films soft; not very adherent.

General

Gold is a chemical element with symbol Au (from Latin: aurum) and atomic number 79. In its purest form, it is a bright, slightly reddish yellow, dense, soft, malleable, and ductile metal. Chemically, gold is a transition metal and a group 11 element. It is one of the least reactive chemical elements and is solid under standard conditions. Gold often occurs in free elemental (native) form, as nuggets or grains, in rocks, in veins, and in alluvial deposits. It occurs in a solid solution series with the native element silver (as electrum) and also naturally alloyed with copper and palladium. The gold sputtering targets are common used as semiconductor and optical recording materials.

Material Notes

Gold Sputtering Targets, Purity is 99.99-99.999%; Circular: Diameter <= 14inch, Thickness >= 1mm; Block: Length <= 32inch, Width <= 12inch, Thickness >= 1mm. Precious Metals Recycling Program.We offer a precious metals recycling program designed to reduce your material costs.
 


Other Information of Gold Sputtering Targets

Applications
Electronics
• Semiconductor
• Flat panel displays
Features
Competitive pricing
• High purity
• Grain refined, engineered microstructure
• Semiconductor grade

Manufacturing Process
Refining
  Three-layer electrolytic process
• Melting and casting
  Electrical resistance furnace - Semi-continuous casting
• Grain refinement
  Thermomechanical treatment
• Cleaning and final packaging - Cleaned for use in vacuum
  Protection from environmental contaminants
  Protection during shipment
Options
99.99% minimum purity
• Smaller sizes also available for R&D applications
• Sputtering target bonding service
 
 
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