Gold Sputtering Targets (Au)
| Material Type | Gold |
| Symbol | Au |
| Atomic Weight | 196.966569 |
| Atomic Number | 79 |
| Color/Appearance | Gold, Metallic |
| Thermal Conductivity | 320 W/m.K |
| Melting Point (°C) | 1,064 |
| Coefficient of Thermal Expansion | 14.2 x 10-6/K |
| Theoretical Density (g/cc) | 19.3 |
| Z Ratio | 0.381 |
| Sputter | DC |
|
Max Power Density* (Watts/Square Inch) |
100 |
| Type of Bond | Indium, Elastomer |
| Comments | Films soft; not very adherent. |
Gold Sputtering Targets
Gold is a chemical element with the symbol Au (from Latin: aurum) and atomic number 79. Its purest form is a bright, slightly reddish yellow, dense, soft, malleable, and ductile metal. Chemically, gold is a transition metal and a group 11 element. It is one of the least reactive chemical elements and is solid under standard conditions. Gold often occurs in free elemental (native) form, as nuggets or grains, in rocks, in veins, and alluvial deposits. It appears in a solid solution series with the native element silver (as electrum) and naturally alloyed with copper and palladium. The gold sputtering targets are commonly used as a semiconductor and optical recording materials.
Gold Sputtering Targets Information
Gold Sputtering Targets
Purity: 99.99-99.999%;
Circular: Diameter <= 14 inch, Thickness >= 1mm;
Block: Length <= 32 inch, Width <= 12 inch, Thickness >= 1mm.
Precious Metals Recycling Program. We offer a precious metals recycling program, designed to reduce your material costs.
More Information on Gold Sputtering Targets
Applications• Electronics• Semiconductor • Flat panel displays |
Features• Competitive pricing• High purity • Grain refined, Engineered microstructure • Semiconductor grade |
Manufacturing Process• RefiningThree-layer electrolytic process • Melting and casting Electrical resistance furnace - Semi-continuous casting • Grain refinement Thermomechanical treatment • Cleaning and final packaging - Cleaned for use in vacuum Protection from environmental contaminants Protection during shipment |
Options• 99.99% minimum purity• Smaller sizes also available for R&D applications • Sputtering target bonding service |
Related Products of Gold Sputtering Targets
|
Ceramic Sputtering Targets N/A |
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Evaporation Materials |
Crucibles N/A |
Metal Powders N/A |
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