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AEM Deposition

Gold Copper Sputtering Targets (Au/Cu)

Gold Copper Sputtering Targets (Au/Cu)
Gold Copper Sputtering Targets (Au/Cu)

Gold Copper Sputtering Target

Gold Copper Sputtering Targets
Purity is 99.9%;
Circular: Diameter <= 14inch, Thickness >= 1mm;
Block: Length <= 32inch, Width <= 12inch, Thickness >= 1mm.

Other Information of Gold Copper Sputtering Target


• Semiconductor
• Chemical vapor deposition (CVD)
• Physical vapor deposition (PVD) display


• Competitive pricing
• High purity
• Grain refined, engineered microstructure
• Semiconductor grade

Manufacturing Process

• Refining
  Three-layer electrolytic process
• Melting and casting
  Electrical resistance furnace - Semi-continuous casting
• Grain refinement
  Thermomechanical treatment
• Cleaning and final packaging - Cleaned for use in vacuum
  Protection from environmental contaminants
  Protection during shipment


• 99.9% minimum purity
• Planar circular targets up to 18'' (457mm) diameter
• Planar tiles up to 48'' (1200mm) X 15.75'' (400mm) for larger target configurations
• Smaller sizes also available for R&D applications
• Sputtering target bonding service

Related Products of Gold Copper Sputtering Target

Ceramic Sputtering Targets
Evaporation Materials
Metal Powders

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