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AEM Deposition

Gold Tin Sputtering Targets (Au/Sn 80/20 wt%)

Gold Tin Sputtering Targets (Au/Sn 80/20 wt%)
Gold Tin Sputtering Targets (Au/Sn 80/20 wt%)
Material Type Gold Tin
Symbol Al/Sn 80/20 wt%
Color/Appearance Gold-colored solid
Thermal Conductivity 57 W/m.K
Melting Point (°C) 280
Coefficient of Thermal Expansion 16 x 10-6/K
Sputter DC
Type of Bond Indium, Elastomer

Gold Tin Sputtering Target

Gold Tin (Au/Sn, or 80% gold, 20% tin by weight ) is a unique material. It is used in a variety of applications requiring a high reliability, high melting solder joint.  This particular alloy of gold tin (Au/Sn) has a melting temperature of 280ºC, which is lower than the 350ºC transition temperature into braze materials.  Still, there are some similarities between this solder alloy and braze alloys. The most obvious is the hardness of the gold tin (AuSn) alloy. With a tensile strength of 40,000PSI, this solder is much more rigid than the tin solders most are familiar with. The strength is more closely compared to the silver brazes which melt above 500ºC. 

Gold Tin Sputtering Target Information

Gold Tin Sputtering Targets (Au/Sn 80/20 wt%) 
Purity is 99.9%;
Circular: Diameter <= 14inch, Thickness >= 1mm;
Block: Length <= 32inch, Width <= 12inch, Thickness >= 1mm.

Other Information of Gold Tin Sputtering Target


• Semiconductor
• Chemical vapor deposition (CVD)
• Physical vapor deposition (PVD) display


• Competitive pricing
• High purity
• Grain refined, engineered microstructure
• Semiconductor grade

Manufacturing Process

• Refining
  Three-layer electrolytic process
• Melting and casting
  Electrical resistance furnace - Semi-continuous casting
• Grain refinement
  Thermomechanical treatment
• Cleaning and final packaging - Cleaned for use in vacuum
  Protection from environmental contaminants
  Protection during shipment


• 99.9% minimum purity
• Planar circular targets up to 18'' (457mm) diameter
• Planar tiles up to 48'' (1200mm) X 15.75'' (400mm) for larger target configurations
• Smaller sizes also available for R&D applications
• Sputtering target bonding service

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