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  • The Process of ITO Sputtering Target Prepared by Sintering at Atmospheric Pressure

    views, Updated: 2021-09-15
    ITO sputtering target material is indium tin oxide target material. A layer of transparent and conductive film is plated on glass substrate or organic film through magnetron sputtering technology, that is ITO film. ITO sputtering target can be prepared by many methods. The sintering law under normal pressure is one of them.
    The normal pressure sintering method is to prepare a high-density target blank utilizing pre-pressing (or slurry casting). The target blank is sintered in a certain atmosphere and temperature. Through the control of sintering temperature and sintering atmosphere, the growth of target blank grain is effectively controlled to achieve high densification of target and uniformity of grain distribution.
    Advantages of sintering at atmospheric pressure
    The target size obtained by the atmospheric sintering method is not limited by the equipment. It has other advantages like high production efficiency, less equipment investment, low production cost, high product density, low oxygen deficiency rate, large size, and excellent target performance, which is suitable for the performance requirements of high-end display coating target.
    Technical difficulties of sintering at atmospheric pressure
    The advantages of atmospheric sintering are obvious, but many technical difficulties have not been overcome—for example, the control of powder purity, particle size, and powder oxygen content. The selection and addition of powder binder, forming high-density plain billet, control the sintering atmosphere and temperature, control internal target defects, deformation, cracks, and other defects in the sintering process. These techniques lead to the fact that this method is the most difficult to sinter than other methods. In order to obtain dense sinter, it is often necessary to improve the sintering activity of raw powder or add sintering aids. It is difficult to remove the activator and sintering assistant from the sinter.
    At present, the density of ITO target material can reach more than 99.5%, and the maximum size of the target material can reach more than 2200 × 2500mm. For large-scale ITO target, because of the technical difficulty, only some companies can achieve this milestone.
    As a sputtering target supplier and manufacturer in China, AEM Deposition provides all kinds of pure metal sputtering targets, alloy sputtering targets, ceramic compound sputtering targets, and other targets. See the following list for details:
    Pure Metal Sputtering Target Alloy Sputtering Target Oxide Sputtering Target Sulfide Sputtering Target
    Boride Sputtering Target Carbide Sputtering Target Silicide Sputtering Target
    Telluride Sputtering Target Nitride Sputtering Target Fluoride Sputtering Target  

    If you need ITO sputtering target or other related sputtering targets, you can go to the sputtering target product page for more details. You can also email us directly for consultation. E-mail: [email protected]