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Neodymium Sputtering Targets (Nd)

Neodymium Sputtering Targets (Nd)
Material Type Neodymium
Symbol Nd
Atomic Weight 144.242
Atomic Number 60
Color/Appearance Silvery White, Yellowish Tinge, Metallic
Thermal Conductivity 17 W/m.K
Melting Point (°C) 1,021
Coefficient of Thermal Expansion 9.6 x 10-6/K
Theoretical Density (g/cc) 7.01
Z Ratio **1.00
Sputter DC
Max Power Density*
(Watts/Square Inch)
UN Number 2813
Comments Low W solubility.


Neodymium, a rare earth metal, was present in the classical mischmetal at a concentration of about 18%. Metallic neodymium has a bright, silvery metallic luster, but as one of the more reactive lanthanide rare-earth metals, it quickly oxidizes in ordinary air. The oxide layer forms then peels off, exposing the metal to further oxidation. Thus, a centimeter-sized sample of neodymium completely oxidizes within a year.Neodymium commonly exists in two allotropic forms, with a transformation from a double hexagonal to a body-centered cubic structure taking place at about 863 ℃.

Material Notes

Neodymium Sputtering Targets, Purity is 99.9%; Circular: Diameter <= 14inch, Thickness >= 1mm; Block: Length <= 32inch, Width <= 12inch, Thickness >= 1mm. Due to the highly reactive nature of these materials, packaging in oil is required to reduce the opportunity for oxidation or other reaction.

Other Information of Neodymium Sputtering Targets

• Semiconductor
• Flat panel displays
Competitive pricing
• High purity
• Grain refined, engineered microstructure
• Semiconductor grade

Manufacturing Process
  Three-layer electrolytic process
• Melting and casting
  Electrical resistance furnace - Semi-continuous casting
• Grain refinement
  Thermomechanical treatment
• Cleaning and final packaging - Cleaned for use in vacuum
  Protection from environmental contaminants
  Protection during shipment
99.999% minimum purity
• Semiconductor grade aluminum alloys available
• Planar circular targets up to 18'' (457mm) diameter
• Planar tiles up to 48'' (1200mm) X 15.75'' (400mm) for larger target configurations
• Smaller sizes also available for R&D applications
• Sputtering target bonding service
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