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Neodymium Sputtering Targets (Nd)

Neodymium Sputtering Targets (Nd)
Material Type Neodymium
Symbol Nd
Atomic Weight 144.242
Atomic Number 60
Color/Appearance Silvery White, Yellowish Tinge, Metallic
Thermal Conductivity 17 W/m.K
Melting Point (°C) 1,021
Coefficient of Thermal Expansion 9.6 x 10-6/K
Theoretical Density (g/cc) 7.01
Z Ratio **1.00
Sputter DC
Max Power Density*
(Watts/Square Inch)
30
UN Number 2813
Comments Low W solubility.

General

Neodymium, a rare earth metal, was present in the classical mischmetal at a concentration of about 18%. Metallic neodymium has a bright, silvery metallic luster, but as one of the more reactive lanthanide rare-earth metals, it quickly oxidizes in ordinary air. The oxide layer forms then peels off, exposing the metal to further oxidation. Thus, a centimeter-sized sample of neodymium completely oxidizes within a year.Neodymium commonly exists in two allotropic forms, with a transformation from a double hexagonal to a body-centered cubic structure taking place at about 863 ℃.

Material Notes

Neodymium Sputtering Targets, Purity is 99.9%; Circular: Diameter <= 14inch, Thickness >= 1mm; Block: Length <= 32inch, Width <= 12inch, Thickness >= 1mm. Due to the highly reactive nature of these materials, packaging in oil is required to reduce the opportunity for oxidation or other reaction.
 


Other Information of Neodymium Sputtering Targets

Applications
Electronics
• Semiconductor
• Flat panel displays
Features
Competitive pricing
• High purity
• Grain refined, engineered microstructure
• Semiconductor grade

Manufacturing Process
Refining
  Three-layer electrolytic process
• Melting and casting
  Electrical resistance furnace - Semi-continuous casting
• Grain refinement
  Thermomechanical treatment
• Cleaning and final packaging - Cleaned for use in vacuum
  Protection from environmental contaminants
  Protection during shipment
Options
99.999% minimum purity
• Semiconductor grade aluminum alloys available
  Al/Si,Al/Cu,Al/Cu/Si
• Planar circular targets up to 18'' (457mm) diameter
• Planar tiles up to 48'' (1200mm) X 15.75'' (400mm) for larger target configurations
• Smaller sizes also available for R&D applications
• Sputtering target bonding service
 
 
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