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AEM Deposition

Silver Sputtering Targets (Ag)

Silver Sputtering Targets (Ag)
Silver Sputtering Targets (Ag)Silver Sputtering Targets (Ag)
Material Type Silver
Symbol Ag
Atomic Weight 107.8682
Atomic Number 47
Color/Appearance Silver, Metallic
Thermal Conductivity 430 W/m.K
Melting Point (°C) 962
Coefficient of Thermal Expansion 18.9 x 10-6/K
Theoretical Density (g/cc) 10.5
Z Ratio 0.529
Sputter DC
Max Power Density*
(Watts/Square Inch)
Type of Bond Indium, Elastomer


Silver is a soft, lustrous element that belongs to the transition group of metals on the periodic table. It has a melting point of 962 , a density of 10.5 g/cc, and vapor pressure of 10-4 Torr at 1,105 . Silver has been used since ancient times in countless products. It is ductile, malleable, and the most electrically conductive of all metals. It is considered a precious metal and can be found in jewelry, solders, paints, and mirrors. It is evaporated under vacuum for the production of semiconductors, sensors, fuel cells, and optical coatings. Silver is the metallic element with the atomic number 47. Its symbol is Ag, from the Latin argentum, derived from the Greek (literally "shiny" or "white"), and ultimately from a Proto-Indo-European language root reconstructed as *h2er, "grey" or "shining". A soft, white, lustrous transition metal, it exhibits the highest electrical conductivity, thermal conductivity, and reflectivity of any metal. The metal is found in the Earth's crust in the pure, free elemental form ("native silver"), as an alloy with gold and other metals, and in minerals such as argentite and chlorargyrite. Most silver is produced as a byproduct of copper, gold, lead, and zinc refini.

Material Notes

Silver Sputtering Targets, Purity is 99.99%; Circular: Diameter <= 14inch, Thickness >= 1mm; Block: Length <= 32inch, Width <= 12inch, Thickness >= 1mm.

Other Information of Sliver Sputtering Targets

• Semiconductor
• Flat panel displays
Competitive pricing
• High purity
• Grain refined, engineered microstructure
• Semiconductor grade

Manufacturing Process
  Three-layer electrolytic process
• Melting and casting
  Electrical resistance furnace - Semi-continuous casting
• Grain refinement
  Thermomechanical treatment
• Cleaning and final packaging - Cleaned for use in vacuum
  Protection from environmental contaminants
  Protection during shipment
• 99.99% minimum purity
• Semiconductor grade aluminum alloys available
  Ag-Pd-Cu sputtering target
• Smaller sizes also available for R&D applications
• Sputtering target bonding service

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