Copper Silver Sputtering Targets (Cu/Ag 84:16 wt%)
General
Material Notes
Copper Silver Sputtering Targets, Purity is 99.9%;Circular: Diameter <= 14inch, Thickness >= 1mm; Block: Length <= 32inch, Width <= 12inch, Thickness >= 1mm.
Other Information of Copper Sliver Sputtering Targets
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Applications • Semiconductor • Chemical vapor deposition (CVD) • Physical vapor deposition (PVD) display |
Features • Competitive pricing • High purity • Grain refined, engineered microstructure • Semiconductor grade |
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Manufacturing Process • Refining Three-layer electrolytic process • Melting and casting Electrical resistance furnace - Semi-continuous casting • Grain refinement Thermomechanical treatment • Cleaning and final packaging - Cleaned for use in vacuum Protection from environmental contaminants Protection during shipment |
Options • 99.9% minimum purity • Planar circular targets up to 18'' (457mm) diameter • Planar tiles up to 48'' (1200mm) X 15.75'' (400mm) for larger target configurations • Smaller sizes also available for R&D applications • Sputtering target bonding service |
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