Copper Silver Sputtering Targets (Cu/Ag 84:16 wt%)
Copper Silver Sputtering Target
Copper Silver Sputtering Targets
Purity is 99.9%;
Circular: Diameter <= 14inch, Thickness >= 1mm;
Block: Length <= 32inch, Width <= 12inch, Thickness >= 1mm.
Other Information of Copper Sliver Sputtering Target
Applications• Semiconductor• Chemical vapor deposition (CVD) • Physical vapor deposition (PVD) display |
Features• Competitive pricing• High purity • Grain refined, engineered microstructure • Semiconductor grade |
Manufacturing Process• RefiningThree-layer electrolytic process • Melting and casting Electrical resistance furnace - Semi-continuous casting • Grain refinement Thermomechanical treatment • Cleaning and final packaging - Cleaned for use in vacuum Protection from environmental contaminants Protection during shipment |
Options• 99.9% minimum purity• Smaller sizes also available for R&D applications • Sputtering target bonding service |
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Metal Powders Copper Powder |
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