86-0731-89578196 [email protected]
AEM Deposition
  • NEWS & EVENTS
  •  
  • Sputtering Targets News
  • Target Bonding News
  • Evaporation Materials News
  • Evaporation Sources News
  • Substrates & Wafers News
  • Powder News
  • Surface Treatment Process of Physical Vapor Deposition (Attached Figure)

    Physical vapor deposition refers to the deposition of the evaporated material and its reaction products on the workpiece by using the arc discharge technology of low voltage and high current under the vacuum condition, using the gas discharge to evaporate the target and ionize the evaporated material and gas, and using the acceleration of electric field.
     
    The main methods of PVD are vacuum evaporation, sputtering, arc plasma, ion and MBE. At present, physical vapor deposition technology can deposit metal films, alloy films, compounds, ceramics, semiconductors, polymer films, etc.
     
    So, what is the process of physical vapor deposition? Look directly at the following figure:

     
     
     
    From the above diagrams, we can directly see that argon dissociates into positively charged argon ions (argon plasma effect) and negatively charged electrons through high voltage. Finally deposited on the surface of the workpiece.
     
    If you still don't understand that, Please send us an email directly. We (AEM Deposition) is an international company involved in the R & D, manufacturing and sales of all kinds of high-tech materials. We provide worldwide research institutes and high-tech enterprises with high purity non-ferrous materials, customized alloys, compounds and almost every kind of complicated synthetic material, etc. We have great advantages in magnetron sputtering targets, vacuum coating materials, high-purity metals, high-purity compounds, rare-earth metals, distilled rare-earth metals, coated substrates, etc.
     
    LATEST NEWS