Preparation of ITO Sputtering Target by Spark Plasma Sintering
ITO sputtering target
has high transmittance and low resistivity. High quality ITO films need ITO sputtering target with high density, purity and uniformity. At present, the preparation methods of ITO sputtering target mainly include hot pressing, cold isostatic pressing sintering and hot isostatic pressing. Today, I would like to introduce the spark plasma sintering method.
Spark plasma sintering
Under the action of pulse current, spark plasma sintering (SPS) can activate the surface of grain through partial current of sample and gap, generate plasma through partial discharge between pores, and activate and heat the surface of powder grain; meanwhile, it can heat the mould through partial current of mould, so that the mould begins to heat transfer the specimen, the temperature of specimen increases, shrinks, and produces certain density With the increase of the sintering temperature, the shrinkage is finished and the densification reaches the maximum.
Characteristics of spark plasma sintering
Compared with the traditional sintering method, SPS technology can reduce the sintering temperature and increase the density, but also improve the strength and toughness. Using SPS to prepare high density and fine grain ceramics can not only reduce the sintering temperature and increase the density, but also greatly shorten the sintering time, which can effectively save energy and improve production efficiency for industrial production.
AEM Deposition, as a sputtering target supplier
and manufacturer in China, can provide all kinds of pure metal sputtering targets, alloy sputtering targets, ceramic compound sputtering targets and other targets. See the following list for details:
If you need ITO sputtering target or other related sputtering targets, you can go to the sputtering target product page for more details. You can also email us directly for consultation. E-mail: [email protected]