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Tantalum Sputtering Targets (Ta)

Tantalum Sputtering Targets (Ta)
Material Type Tantalum
Symbol Ta
Atomic Weight 180.94788
Atomic Number 73
Color/Appearance Gray Blue, Metallic
Thermal Conductivity 57 W/m.K
Melting Point (°C) 3,017
Coefficient of Thermal Expansion 6.3 x 10-6/K
Theoretical Density (g/cc) 16.6
Z Ratio 0.262
Sputter DC
Max Power Density*
(Watts/Square Inch)
100
Type of Bond Indium, Elastomer
Comments Forms good films.

General

Tantalum is a dark (blue-gray) metal with high dense, good ductile and highly conductive of heat and electricity. Since tantalum can form thin oxides and the film has a protective effect, tantalum is widely used as a base material in the manufacturing process of electrolytic capacitors. Tantalum sputtering targets are applicated in microelectronic fileds, such as thermal inkjet print head, copper plating and through-silicon via technology. Since high-temperature inks can cause cavitation in some ink-jet printing apparatuses, the tantalum sputteurng target can be as the anti-cavitation films to protect the ink facilities. Some tantalum sputtering targets also applicated in glass coating.

Material Notes

Purity: 99.95%-99.99%
Circular: Diameter <= 14inch, Thickness >= 1mm
Block: Length <= 32inch, Width <= 12inch, Thickness >= 1mm
Targets Type: Planar sputtering target, Rotary sputtering target


Other Information of Tantalum Sputtering Targets

Applications
Optical films
 Electronic
• Semiconductor
• Diffusion barrier layer
Features
• High purity
• Grain refined, engineered microstructure

( the average grain size < 100 um)
 

Manufacturing Process
Melting
  Multiple step electron beam melting (EB)

 Analysis (GDMS, ICP-OES, LECO)
• Grain refinement
  Thermomechanical treatment 
(Forging, Rolling, Annealing)
• Cleaning and final packaging - Cleaned for use in vacuum
  Protection from environmental contaminants
  Protection during shipment
Options
99.95% minimum purity
• Smaller sizes also available for R&D applications
• Sputtering target bonding service
 
 

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