Tantalum Sputtering Targets (Ta)
| Material Type | Tantalum |
| Symbol | Ta |
| Atomic Weight | 180.94788 |
| Atomic Number | 73 |
| Color/Appearance | Gray Blue, Metallic |
| Thermal Conductivity | 57 W/m.K |
| Melting Point (°C) | 3,017 |
| Coefficient of Thermal Expansion | 6.3 x 10-6/K |
| Theoretical Density (g/cc) | 16.6 |
| Z Ratio | 0.262 |
| Sputter | DC |
|
Max Power Density* (Watts/Square Inch) |
100 |
| Type of Bond | Indium, Elastomer |
| Comments | Forms good films. |
Tantalum Sputtering Targets
Tantalum is a dark (blue-gray) metal with high density, good ductile, and highly conductive heat and electricity. Since tantalum can form thin oxides and the film has a protective effect, tantalum is widely used as a base material in the manufacturing process of electrolytic capacitors. Tantalum sputtering targets are applied in microelectronic fields, such as thermal ink-jet print head, copper plating, and through-silicon via technology. Since high-temperature inks can cause cavitation in some ink-jet printing machines, the tantalum sputtering target can be the anti-cavitation films to protect the ink facilities. Some tantalum sputtering targets are also applied in the glass coating.
Tantalum Sputtering Targets Information
Tantalum Sputtering Targets
Purity: 99.95%-99.99%
Circular: Diameter <= 14 inch, Thickness >= 1mm
Block: Length <= 32 inch, Width <= 12 inch, Thickness >= 1mm
Targets Type: Planar sputtering target, Rotary sputtering target
More Information on Tantalum Sputtering Targets
Applications• Optical films• Electronic • Semiconductor • Diffusion barrier layer |
Features• High purity• Grain refined, Engineered microstructure ( the average grain size < 100 um) |
Manufacturing Process• MeltingMultiple step electron beam melting (EB) • Analysis (GDMS, ICP-OES, LECO) • Grain refinement Thermomechanical treatment (Forging, Rolling, Annealing) • Cleaning and final packaging - Cleaned for use in vacuum Protection from environmental contaminants Protection during shipment |
Options• 99.95% minimum purity• Smaller sizes also available for R&D applications • Sputtering target bonding service |
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