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Tantalum Silicide Sputtering Targets (TaSi2)

Tantalum Silicide Sputtering Targets (TaSi2)
Material Type Tantalum Silicide
Symbol TaSi2
Color/Appearance Grey, Solid
Melting Point (°C) 2,200
Theoretical Density (g/cc) 9.14
Water Solubility Insoluble
Sputter RF, RF-R, DC
Type of Bond Indium, Elastomer
Comments  

General

Tantalum silicide (TaSi2) thin films were sputter deposited on P- type and N- type silicon substrates using VARIAN 3125 magnetron DC sputtering system with TaSi 2 target. AEM specializes in producing high purity Tantalum Silicide Sputtering Targets with the highest possible density and smallest possible average grain sizes for use in semiconductor, chemical vapor deposition (CVD) and physical vapor deposition (PVD) display and optical applications. 

Material Notes

Tantalum Silicide Sputtering Target, Purity is 99.5%; Circular: Diameter <= 14inch, Thickness >= 1mm; Block: Length <= 32inch, Width <= 12inch, Thickness >= 1mm. Bonding is recommended for these materials. Many materials have characteristics which are not amenable to sputtering, such as, brittleness and low thermal conductivity.This material may require special ramp up and ramp down procedures. This process may not be necessary with other materials. Targets that have a low thermal conductivity are susceptible to thermal shock.

 


Other Information of Tantalum Silicide Sputtering Targets
 

Applications
  PVD and CVD display
• Semiconductor

• Optical

Features
• High purity
• Custom Sizes Available

 

Manufacturing Process
• Manufacturing - Cold pressed - Sintered, Elastomer bonded to backing plate

• Cleaning and final packaging, Cleaned for use in vacuum,
Protection from environmental contaminants
Protection during shipment

Options
• 99% Minimum Purity

• Up to 12'' Diameter Targets Available

• Planar Tiles Up to 8'' X 5'' for Larger Target Configurations

 

 

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