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Bismuth Sputtering Targets (Bi)

Bismuth Sputtering Targets (Bi)
Material Type Bismuth
Symbol Bi
Atomic Weight 208.9804
Atomic Number 83
Color/Appearance Lustrous Reddish White, Metallic
Thermal Conductivity 8 W/m.K
Melting Point (°C) 271
Coefficient of Thermal Expansion 13.4 x 10-6/K
Theoretical Density (g/cc) 9.8
Z Ratio 0.79
Sputter DC
Max Power Density*
(Watts/Square Inch)
10
Type of Bond Indium, Elastomer
Export Control (ECCN) 1C229
Comments Resistivity high. Low Melting Point materials not ideal for sputtering.

General

Bismuth is a chemical element with the symbol Bi and atomic number 83. Bismuth, a pentavalent post-transition metal and one of the pnictogens, chemically resembles its lighter homologs arsenic and antimony. Elemental bismuth may occur naturally, although its sulfide and oxide form important commercial ores. The free element is 86% as dense as lead. It is a brittle metal with a silvery white color when freshly produced, but surface oxidation can give it a pink tinge. Bismuth is the most naturally diamagnetic element, and has one of the lowest values of thermal conductivity among metals.

Material Notes

Bismuth Sputtering Targets, Purity is 99.9-99.999%;
Circular: Diameter <= 14inch, Thickness >= 1mm;
Block: Length <= 32inch, Width <= 12inch, Thickness >= 1mm.
 


Other Information of Bismuth Sputtering Targets

Applications
Electronics
• Semiconductor
• Flat panel displays
Features
Competitive pricing
• High purity
• Grain refined, engineered microstructure
• Semiconductor grade

Manufacturing Process
Refining
  Three-layer electrolytic process
• Melting and casting
  Electrical resistance furnace - Semi-continuous casting
• Grain refinement
  Thermomechanical treatment
• Cleaning and final packaging - Cleaned for use in vacuum
  Protection from environmental contaminants
  Protection during shipment
Options
99.9% minimum purity
• Planar circular targets up to 14'' (355.6mm) diameter
• Planar tiles up to 32'' (812.8mm) X 12'' (304.8mm) for larger target configurations
• Smaller sizes also available for R&D applications
• Sputtering target bonding service
 
 
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