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Bismuth Telluride Sputtering Targets (Bi2Te3)

Bismuth Telluride Sputtering Targets (Bi2Te3)
Material Type Bismuth Telluride
Symbol Bi2Te3
Color/Appearance Gray, Crystalline Solid
Melting Point (°C) 573
Theoretical Density (g/cc) 7.7
Z Ratio 1.00
Sputter RF
Type of Bond Indium, Elastomer
UN Number 3284
Comments Co-evap from 2 sources or sputter.

General

Bismuth telluride (Bi2Te3) is a gray powder that is a compound of bismuth and tellurium also known as bismuth(III) telluride. It is a semiconductor which, when alloyed with antimony or selenium is an efficient thermoelectric material for refrigeration or portable power generation. Bi2Te3 is a topological insulator, and thus exhibits thickness-dependent physical properties. AEM Deposition specializes in producing high purity Bismuth Telluride (Bi2Te3) Sputtering Targets with the highest possible density. High Purity (99.99%) Bismuth Telluride Sputtering Target with smallest possible average grain sizes can be used for semiconductor, chemical vapor deposition (CVD) and physical vapor deposition (PVD) display and optical applications.

Material Notes

Bismuth Telluride Sputtering Target, Purity is 99.999%; Circular: Diameter <= 14inch, Thickness >= 1mm; Block: Length <= 32inch, Width <= 12inch, Thickness >= 1mm. Hazardous shipping charges may apply.
 


Other Information of Bismuth Telluride Sputtering Targets

Applications
 Semiconductor
• Chemical vapor deposition (CVD)
• Physical vapor deposition (PVD) display

Features
Competitive pricing
• High purity
• Grain refined, engineered microstructure
• Semiconductor grade


Manufacturing Process
Refining
  Three-layer electrolytic process
• Melting and casting
  Electrical resistance furnace - Semi-continuous casting
• Grain refinement
  Thermomechanical treatment
• Cleaning and final packaging - Cleaned for use in vacuum
  Protection from environmental contaminants
  Protection during shipment

Options
99.999% minimum purity
• Planar circular targets up to 18'' (457mm) diameter
• Planar tiles up to 48'' (1200mm) X 15.75'' (400mm) for larger target configurations
• Smaller sizes also available for R&D applications
• Sputtering target bonding service

 

 

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