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Copper Sputtering Targets (Cu)

Copper Sputtering Targets (Cu)
Material Type Copper
Symbol Cu
Atomic Weight 63.546
Atomic Number 29
Color/Appearance Copper, Metallic
Thermal Conductivity 400 W/m.K
Melting Point (°C) 1,083
Coefficient of Thermal Expansion 16.5 x 10-6/K
Theoretical Density (g/cc) 8.92
Z Ratio 0.437
Sputter DC
Max Power Density*
(Watts/Square Inch)
200
Type of Bond Indium, Elastomer
Comments Adhesion poor. Use interlayer (Cr). Evaporates using any source material.

General of Copper

Copper is a ductile metal with very high thermal conductivity, electrical conductivity, ductility, corrosion resistance. A freshly exposed surface of pure copper has a reddish-orange color. High-purity copper is used as various wires in the electronics industry, bonding wires for electronic packaging, high-quality audio cables and integrated circuits, liquid crystal display sputtering targets, and ion plating. It is also an indispensable valuable material in atomic energy, rockets, missiles, aviation, space navigation, and metallurgical industries. AEM can provide high purity OFC, Cupronickel and alloy products as you requested.

Material Notes of Copper Sputtering Targets

Purity: 99.99-99.9999%
Circular: Diameter <= 14inch, Thickness >= 1mm
Block: Length <= 32inch, Width <= 12inch, Thickness >= 1mm
Targets Type: Planar sputtering target, Rotary sputtering target
 

Analysis of Copper Sputtering Targets

AEM Deposition manufacture copper sputtering targets with high purity, the highest purity can reach to 99.9999%. The significant benefits are that your films possess an outstanding level of electrical conductivity and minimized particle formation during the PVD process. The analytical methods we use includes:

1. Metallic elements were analyzed using ICP-OES.
2. Gas elements were analyzed using LECO.

Below form is a Certificate of Analysis (COA) for 99.999% high purity Copper Sputtering Target:

copper sputtering target COA

Other Information of Copper Sputtering Targets


Applications
Electronics
• Semiconductor
• Flat panel displays
Features
Competitive pricing
• High purity and density
• Grain refined, engineered microstructure ( the average grain size < 50 um)
• Semiconductor grade

Manufacturing Process
• Melting and casting
  Electrical resistance furnace - Semi-continuous casting (VIM&EB)
• Grain refinement
  Thermomechanical treatment (Forging, Rolling, Annealing)
• Cleaning and final packaging - Cleaned for use in vacuum
  Protection from environmental contaminants
  Protection during shipment
Options
99.99% minimum purity
• Semiconductor grade copper alloys targets
Cu/Zn 50/50 wt%, Al/Si/Cu, Al/Cu, Au/Cu, Cu/Ag 84:16 wt%, Cu2Te,
• Semiconductor grade
copper compound targets
CuS, Cu2S, SrCuO2, Sm(1-x)CexCuO4, Nd2CuO4, La(1-x)SrxCuO4, La2CuO4, La2CuMnO6, SmCuO4 and Sm2CuOx, CuO, Cu2O, CuAlO2, CIGS, Cu2Se
• Sputtering target bonding service
 
 

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