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Copper Sputtering Targets (Cu)

Copper Sputtering Targets (Cu)
Material Type Copper
Symbol Cu
Atomic Weight 63.546
Atomic Number 29
Color/Appearance Copper, Metallic
Thermal Conductivity 400 W/m.K
Melting Point (°C) 1,083
Coefficient of Thermal Expansion 16.5 x 10-6/K
Theoretical Density (g/cc) 8.92
Z Ratio 0.437
Sputter DC
Max Power Density*
(Watts/Square Inch)
200
Type of Bond Indium, Elastomer
Comments Adhesion poor. Use interlayer (Cr). Evaporates using any source material.

General of Copper Sputtering Targets

Copper is a chemical element with symbol Cu (from Latin: cuprum) and atomic number 29. It is a soft, malleable, and ductile metal with very high thermal and electrical conductivity. A freshly exposed surface of pure copper has a reddish-orange color. Copper is used as a conductor of heat and electricity, as a building material, and as a constituent of various metal alloys, such as sterling silver used in jewelry, cupronickel used to make marine hardware and coins, and constantan used in strain gauges and thermocouples for temperature measurement.

Material Notes of Copper Sputtering Targets

Purity: 99.99-99.999%
Circular: Diameter <= 14inch, Thickness >= 1mm
Block: Length <= 32inch, Width <= 12inch, Thickness >= 1mm
Targets Type: Planar sputtering target, Rotary sputtering target
 

Analysis of Copper Sputtering Targets

AEM Deposition manufacture copper sputtering targets with high purity, it’s most important benefits are that your films possess an outstanding level of electrical conductivity and minimized particle formation during the PVD process. The analytical methods we use includes:

1. Metallic elements were analyzed using ICP-OES.
2. Gas elements were analyzed using LECO.

Below form is a Certificate of Analysis (COA) for 99.999% high purity Copper Sputtering Target:

copper sputtering target COA

Other Information of Copper Sputtering Targets


Applications
Electronics
• Semiconductor
• Flat panel displays
Features
Competitive pricing
• High purity
• Grain refined, engineered microstructure
• Semiconductor grade

Manufacturing Process
Refining
  Three-layer electrolytic process
• Melting and casting
  Electrical resistance furnace - Semi-continuous casting
• Grain refinement
  Thermomechanical treatment
• Cleaning and final packaging - Cleaned for use in vacuum
  Protection from environmental contaminants
  Protection during shipment
Options
99.999% minimum purity
• Semiconductor grade aluminum alloys available
  Al/Si,Al/Cu,Al/Cu/Si
• Planar circular targets up to 18'' (457mm) diameter
• Planar tiles up to 48'' (1200mm) X 15.75'' (400mm) for larger target configurations
• Smaller sizes also available for R&D applications
• Sputtering target bonding service
 
 

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