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Aluminum Copper Sputtering Targets (Al/Cu)

Aluminum Copper Sputtering Targets (Al/Cu)

General

AEM Deposition specializes in producing high purity Aluminum Copper (Al/Cu) Sputtering Targets with the highest possible density. High Purity (99.9%) Aluminum Copper Sputtering Targets with smallest possible average grain sizes can be used for semiconductor, chemical vapor deposition (CVD) and physical vapor deposition (PVD) display and optical applications.

Material Notes

Aluminum Copper Sputtering Targets, Purity is 99.9%;Circular: Diameter <= 14inch, Thickness >= 1mm; Block: Length <= 32inch, Width <= 12inch, Thickness >= 1mm.
 


Other Information of Copper Aluminum Sputtering Targets

Applications
 Semiconductor
• Chemical vapor deposition (CVD)
• Physical vapor deposition (PVD) display
Features
Competitive pricing
• High purity
• Grain refined, engineered microstructure
• Semiconductor grade

Manufacturing Process
Refining
  Three-layer electrolytic process
• Melting and casting
  Electrical resistance furnace - Semi-continuous casting
• Grain refinement
  Thermomechanical treatment
• Cleaning and final packaging - Cleaned for use in vacuum
  Protection from environmental contaminants
  Protection during shipment
Options
99.9% minimum purity
• Planar circular targets up to 18'' (457mm) diameter
• Planar tiles up to 48'' (1200mm) X 15.75'' (400mm) for larger target configurations
• Smaller sizes also available for R&D applications
• Sputtering target bonding service
 
 
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