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AEM Deposition

Aluminum Copper Sputtering Targets (Al/Cu)

Aluminum Copper Sputtering Targets (Al/Cu)
Aluminum Copper Sputtering Targets (Al/Cu)

Aluminum Copper Sputtering Target

AEM Deposition specializes in producing high purity Aluminum Copper (Al/Cu) Sputtering Targets with the highest possible density. High Purity (99.9%) Aluminum Copper Sputtering Targets with smallest possible average grain sizes can be used for semiconductor, chemical vapor deposition (CVD) and physical vapor deposition (PVD) display and optical applications.

Aluminum Copper Sputtering Target Information

Aluminum Copper Sputtering Targets
Purity: 99.9%;
Circular: Diameter <= 14inch, Thickness >= 1mm;
Block: Length <= 32inch, Width <= 12inch, Thickness >= 1mm.

Other Information of Copper Aluminum Sputtering Target


Applications
• Semiconductor
• Chemical vapor deposition (CVD)
• Physical vapor deposition (PVD) display
Features
• Competitive pricing
• High purity
• Grain refined, engineered microstructure
• Semiconductor grade
Manufacturing Process
• Refining
  Three-layer electrolytic process
• Melting and casting
  Electrical resistance furnace - Semi-continuous casting
• Grain refinement
  Thermomechanical treatment
• Cleaning and final packaging - Cleaned for use in vacuum
  Protection from environmental contaminants
  Protection during shipment
Options
• 99.9% minimum purity
• Planar circular targets up to 18'' (457mm) diameter
• Planar tiles up to 48'' (1200mm) X 15.75'' (400mm) for larger target configurations
• Smaller sizes also available for R&D applications
• Sputtering target bonding service

Related Products of Aluminum Copper Sputtering Target

Evaporation Materials
Crucibles
Alumina Crucible
Metal Powders
Aluminium Powder

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