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Copper Zinc Sputtering Targets (Cu/Zn 50/50 wt%)

Copper Zinc Sputtering Targets (Cu/Zn 50/50 wt%)

General

Material Notes

Copper Zinc Sputtering Targets, Purity is 99.9%;Circular: Diameter <= 14inch, Thickness >= 1mm; Block: Length <= 32inch, Width <= 12inch, Thickness >= 1mm.


Other Information of Copper Zinc Sputtering Targets
 

Applications
 Semiconductor
• Chemical vapor deposition (CVD)
• Physical vapor deposition (PVD) display
Features
• Competitive pricing
• High purity
• Grain refined, engineered microstructure
• Semiconductor grade

 

Manufacturing Process
 Refining
  Three-layer electrolytic process
• Melting and casting
  Electrical resistance furnace - Semi-continuous casting
• Grain refinement
  Thermomechanical treatment
• Cleaning and final packaging - Cleaned for use in vacuum
  Protection from environmental contaminants
  Protection during shipment
Options
• 99.9% minimum purity
• Planar circular targets up to 18'' (457mm) diameter
• Planar tiles up to 48'' (1200mm) X 15.75'' (400mm) for larger target configurations
• Smaller sizes also available for R&D applications
• Sputtering target bonding service

 

     
 
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