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AEM Deposition

Yttrium Sputtering Targets (Y)

Yttrium Sputtering Targets (Y)
Yttrium Sputtering Targets (Y)
Material Type Yttrium
Symbol Y
Atomic Weight 88.90585
Atomic Number 39
Color/Appearance Silvery White, Metallic
Thermal Conductivity 17.2 W/m.K
Melting Point (°C) 1,522
Coefficient of Thermal Expansion 10.6 x 10-6/K
Theoretical Density (g/cc) 4.47
Z Ratio 0.835
Sputter RF, DC
Max Power Density*
(Watts/Square Inch)
Type of Bond Indium, Elastomer
Comments High Ta solubility.

Yttrium Sputtering Target

Yttrium is a chemical element with symbol Y and atomic number 39. It is a silvery-metallic transition metal chemically similar to the lanthanides and has often been classified as a "rare earth element".Yttrium is a soft, silver-metallic, lustrous and highly crystalline transition metal in group 3. As expected by periodic trends, it is less electronegative than its predecessor in the group, scandium, and less electronegative than the next member of period 5, zirconium; additionally, it is of comparable electronegativity to its successor in its group, lutetium, due to the lanthanide contraction. Yttrium is the first d-block element in the fifth period.

Yttrium Sputtering Target Information

Yttrium Sputtering Targets
Purity is 99.99%;
Circular: Diameter <= 14inch, Thickness >= 1mm;
Block: Length <= 32inch, Width <= 12inch, Thickness >= 1mm.

Other Information of Yttrium Sputtering Target


• Electronics
• Semiconductor
• Flat panel displays


• Competitive pricing
• High purity
• Grain refined, engineered microstructure
• Semiconductor grade

Manufacturing Process

• Refining
  Three-layer electrolytic process
• Melting and casting
  Electrical resistance furnace - Semi-continuous casting
• Grain refinement
  Thermomechanical treatment
• Cleaning and final packaging - Cleaned for use in vacuum
  Protection from environmental contaminants
  Protection during shipment


• 99.99% purity, GDMS report available
• Planar circular targets up to 14'' (457mm) diameter
• Planar tiles up to 48''(1200mm) X 15.75''(400mm) for larger target configurations
• Smaller sizes also available for R&D applications
• Sputtering target bonding service
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