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Chromium Sputtering Targets (Cr)

Chromium Sputtering Targets (Cr)
Material Type Chromium
Symbol Cr
Atomic Weight 51.9961
Atomic Number 24
Color/Appearance Silvery, Metallic
Thermal Conductivity 94 W/m.K
Melting Point (°C) 1,857
Coefficient of Thermal Expansion 4.9 x 10-6/K
Theoretical Density (g/cc) 7.2
Z Ratio 0.305
Sputter DC
Max Power Density*
(Watts/Square Inch)
80
Type of Bond Indium, Elastomer
Comments Films very adherent. High rates possible.

General

Chromium is a steely-grey, lustrous, hard and brittle metal which takes a high polish, resists tarnishing, and has a high melting point. Chromium sputtering targets are widely used in hardware tool coating, decorative coating and Flat display coating. Hardware coating is used in various mechanical and metallurgical applications such as robot tools, turning tools, molds (casting, stamping, ...).The thickness of the film is generally 2~10um, and the film requires high hardness, low wear, impact resistance, and resistance with thermal shock and high adhesion porperty. Now, chromium sputtering targets are common applicated in the glass coating industry. The most important application is the preparation of automotive rearview mirrors. With the increasing requirements of automotive rearview mirrors, many companies have switched from the original aluminizing process to the vacuum sputtering chromium process.
 

Material Notes

Purity: 99.5-99.95%
Circular: Diameter <= 14inch, Thickness >= 1mm
Block: Length <= 32inch, Width <= 12inch, Thickness >= 1mm
Targets Type: Planar sputtering target, Rotary sputtering target, Acr cathode
 

Analysis of Chromium Sputtering Targets

AEM Deposition manufacture chromium sputtering targets with high purity, the highest purity can reach to 99.95%. The analytical methods we use includes:

1. Metallic elements were analyzed using ICP-OES.
2. Gas elements were analyzed using LECO.

Below picture is a Metallographic diagram of Chromium Sputtering Target:


Other Information of Chromium Sputtering Targets

Applications
 Decorative coating 
• Hardware tool coating
• Glass coating
• Flat panel displays
Features
Competitive pricing
• High purity and density

Hot isostatic pressing (HIP) process
• Grain refined, engineered microstructure
(average grain size 60-70 um)
• Semiconductor grade

Manufacturing Process
 Powder preparation
• Hot isostatic pressing
 Analysis
• Grain refinement
  Annealing, micrography, machining
• Cleaning and final packaging - Cleaned for use in vacuum
  Protection from environmental contaminants
  Protection during shipment
Options
99.5% minimum purity
• Semiconductor grade c
hromium compound targets
CrO3, Ni/Cr/Al/Si (54-37-6-3 wt%), CrSiO2, Cr2O3, CrN, Ni/Cr, CrSi2, CrSi
• Sputtering target bonding service
 
 
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