Nickel Chromium Aluminum Silicon Sputtering Targets (Ni/Cr/Al/Si (54/37/6/3 wt%))
| Material Type | Nickel Chromium Aluminum Silicon |
| Symbol | Ni/Cr/Al/Si (54-37-6-3 wt%) |
| Sputter | DC |
| Type of Bond | Indium, Elastomer |
Nickel Chromium Aluminum Silicon Sputtering Targets
Nickel Chromium Aluminum Silicon Sputtering Targets (Ni/Cr/Al/Si (54-37-6-3 wt%))
Purity: 99.9%;
Circular: Diameter <= 14 inch, Thickness >= 1mm;
Block: Length <= 32 inch, Width <= 12 inch, Thickness >= 1mm.
More Information on Nickel Chromium Aluminum Silicon Sputtering Targets
Applications• Semiconductor• Chemical Vapor Deposition (CVD) • Physical Vapor Deposition (PVD) |
Features• Competitive pricing• High purity • Grain refined, Engineered microstructure • Semiconductor grade |
Manufacturing Process• RefiningThree-layer electrolytic process • Melting and casting Electrical resistance furnace - Semi-continuous casting • Grain refinement Thermomechanical treatment • Cleaning and final packaging - Cleaned for use in vacuum Protection from environmental contaminants Protection during shipment |
Options• 99.9% minimum purity• Smaller sizes also available for R&D applications • Sputtering target bonding service |
Related Products of Nickel Chromium Aluminum Silicon Sputtering Targets
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Ceramic Sputtering Targets Chromium Oxide Sputtering Target |
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Evaporation Materials Chromium Evaporation Pellet |
Crucibles N/A |
Metal Powders Chromium Powder |
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