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AEM Deposition

Nickel Chromium Aluminum Silicon Sputtering Targets (Ni/Cr/Al/Si (54/37/6/3 wt%))

Nickel Chromium Aluminum Silicon Sputtering Targets (Ni/Cr/Al/Si (54/37/6/3 wt%))
Nickel Chromium Aluminum Silicon Sputtering Targets (Ni/Cr/Al/Si (54/37/6/3 wt%))
Material Type Nickel Chromium Aluminum Silicon
Symbol Ni/Cr/Al/Si (54-37-6-3 wt%)
Sputter DC
Type of Bond Indium, Elastomer

Nickel Chromium Aluminum Silicon Sputtering Target

Nickel Chromium Aluminum Silicon Sputtering Targets (Ni/Cr/Al/Si (54-37-6-3 wt%)),
Purity is 99.9%;
Circular: Diameter <= 14inch, Thickness >= 1mm;
Block: Length <= 32inch, Width <= 12inch, Thickness >= 1mm.
 

Other Information of Nickel Chromium Aluminum Silicon Sputtering Target

Applications

• Semiconductor
• Chemical vapor deposition (CVD)
• Physical vapor deposition (PVD) display

Features

• Competitive pricing
• High purity
• Grain refined, engineered microstructure
• Semiconductor grade

Manufacturing Process

• Refining
  Three-layer electrolytic process
• Melting and casting
  Electrical resistance furnace - Semi-continuous casting
• Grain refinement
  Thermomechanical treatment
• Cleaning and final packaging - Cleaned for use in vacuum
  Protection from environmental contaminants
  Protection during shipment

Options

• 99.9% minimum purity
• Planar circular targets up to 18'' (457mm) diameter
• Planar tiles up to 48'' (1200mm) X 15.75'' (400mm) for larger target configurations
• Smaller sizes also available for R&D applications
• Sputtering target bonding service

Related Products of Nickel Chromium Aluminum Silicon Sputtering Target

 
Ceramic Sputtering Targets
Chromium Oxide Sputtering Target
Evaporation Materials
Chromium Evaporation Pellet
Crucibles
N/A
Metal Powders
Chromium Powder

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