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Nickel Chromium Aluminum Silicon Sputtering Targets (Ni/Cr/Al/Si (54-37-6-3 wt%))

Nickel Chromium Aluminum Silicon Sputtering Targets (Ni/Cr/Al/Si (54-37-6-3 wt%))
Material Type Nickel Chromium Aluminum Silicon
Symbol Ni/Cr/Al/Si (54-37-6-3 wt%)
Sputter DC
Type of Bond Indium, Elastomer

General

 

Material Notes of Nickel Chromium Aluminum Silicon Sputtering Targets

Nickel Chromium Aluminum Silicon Sputtering Targets (Ni/Cr/Al/Si (54-37-6-3 wt%)), Purity is 99.9%; Circular: Diameter <= 14inch, Thickness >= 1mm; Block: Length <= 32inch, Width <= 12inch, Thickness >= 1mm.
 


Other Information of Gold Tin Sputtering Targets

Applications
 Semiconductor
• Chemical vapor deposition (CVD)
• Physical vapor deposition (PVD) display
Features
Competitive pricing
• High purity
• Grain refined, engineered microstructure
• Semiconductor grade

Manufacturing Process
Refining
  Three-layer electrolytic process
• Melting and casting
  Electrical resistance furnace - Semi-continuous casting
• Grain refinement
  Thermomechanical treatment
• Cleaning and final packaging - Cleaned for use in vacuum
  Protection from environmental contaminants
  Protection during shipment
Options
99.9% minimum purity
• Planar circular targets up to 18'' (457mm) diameter
• Planar tiles up to 48'' (1200mm) X 15.75'' (400mm) for larger target configurations
• Smaller sizes also available for R&D applications
• Sputtering target bonding service
 
 
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