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Aluminum Sputtering Targets (Al)

Aluminum Sputtering Targets (Al)
Material Type Aluminum
Symbol Al
Atomic Weight 26.9815386
Atomic Number 13
Color/Appearance Silvery, Metallic
Thermal Conductivity 235 W/m.K
Melting Point (°C) 660
Coefficient of Thermal Expansion 23.1 x 10-6/K
Theoretical Density (g/cc) 2.7
Z Ratio 1.08
Sputter DC
Max Power Density*
(Watts/Square Inch)
Type of Bond Indium, Elastomer
Comments Alloys W/Mo/Ta. Flash evap or use BN crucible.

General of Aluminum

Aluminum is one of the most common metals in the world. It can be found in kitchen utensils, cars, street lights, and the popular aluminum foil food packaging. Aluminum is a silvery-white, metallic material. It is light, malleable, ductile, and non-magnetic under normal conditions. It has a density of 2.7 g/cc, a melting point of 660°C, and a vapor pressure of 10-4 Torr at 1,010°C. Although it is not a strong material, it is a good conductor of heat and electricity and is able to form an oxide layer that is resistant to corrosion. Due to its high reactivity, it is rarely found in nature as a free element. When evaporated in a vacuum, aluminum layers form a reflective coating found on telescopes, automotive headlamps, mirrors, packages, and toys. It is widely used in the aerospace, automotive lighting, OLED, and optical industries.

Material Notes of Aluminum Sputtering Targets

Purity: 99.99-99.999%;
Target type: Planar & Rotary sputtering targets
Circular: Diameter <= 16inch, Thickness >= 1mm;
Block: Length <= 48inch, Width <= 15.75inch, Thickness >= 1mm.

Analysis of Aluminum Sputtering Targets

AEM Deposition high purity Aluminum sputtering tragets,which makes your films possess an outstanding level of electrical conductivity and minimized particle formation during the PVD process. And we usually use two Analytical methods to test our products:
1. Metallic elements were analyzed using GDMS.
2. Gas elements were analyzed using LECO.

Other Infomation of Aluminum Sputtering Targets


• Electronics

• Semiconductor

• Flat panel displays


• Competitive pricing

• High purity

• Grain refined, engineered microstructure

• Semiconductor grade

Manufacturing Process:

• RefiningThree-layer electrolytic process

• Melting and casting Electrical resistance furnace - Semi-continuous casting

• Grain refinementThermomechanical treatment

• Cleaning and final packaging - Cleaned for use in vacuumProtection from environmental contaminantsProtection during shipment


• Aluminum alloys sputtering targets

Al2O3, Ni/Cr/Al/Si, Al/Nd, Y3Al5O12, In2O3/Al2O3/ZnO, Al/Si/Cu, Al/Cu, CuAlO2, AlN, Ni3/Al, Fe/Al, Al/Sc

• Smaller sizes also available for R&D applications

• Sputtering target bonding service

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