Aluminum Sputtering Targets (Al)
| Material Type | Aluminum |
| Symbol | Al |
| Atomic Weight | 26.9815386 |
| Atomic Number | 13 |
| Color/Appearance | Silvery, Metallic |
| Thermal Conductivity | 235 W/m.K |
| Melting Point (°C) | 660 |
| Coefficient of Thermal Expansion | 23.1 x 10-6/K |
| Theoretical Density (g/cc) | 2.7 |
| Z Ratio | 1.08 |
| Sputter | DC |
|
Max Power Density* (Watts/Square Inch) |
150 |
| Type of Bond | Indium, Elastomer |
| Comments | Alloys W/Mo/Ta. Flash evap or use BN crucible. |
General of Aluminum
Aluminum is a silvery-white, metallic material. It can be found in kitchen utensils, cars, street lights, and the popular aluminum foil food packaging. Although it is not a strong material, it is a good conductor of heat and electricity and is able to form an oxide layer that is resistant to corrosion. When evaporated in a vacuum, aluminum layers form a reflective coating found on telescopes, automotive headlamps, mirrors, packages, and toys. Aluminum sputtering target is widely used in the aerospace, automotive lighting, OLED, and optical industries. Some high purity aluminum targets are used in semiconductor chip, flat panel display, solar cell industries.
Material Notes of Aluminum Sputtering Targets
Purity: 99.99-99.9995%;
Target type: Planar & Rotary sputtering targets
Circular: Diameter <= 16inch, Thickness >= 1mm;
Block: Length <= 48inch, Width <= 15.75inch, Thickness >= 1mm.
Analysis of Aluminum Sputtering Targets
AEM Deposition high purity Aluminum sputtering tragets,which makes your films possess an outstanding level of electrical conductivity and minimized particle formation during the PVD process. And we usually use two Analytical methods to test our products:
1. Metallic elements were analyzed using GDMS.
2. Gas elements were analyzed using LECO.
Other Infomation of Aluminum Sputtering Targets
|
Applications • Electronics • Semiconductor • Flat panel displays |
Features • Competitive pricing • High purity • Grain refined, engineered microstructure ( the average grain size < 300 um) • Semiconductor grade |
|
Manufacturing Process • Melting zone melting • Analysis GDMS,ICP-OES • Analysis Casting & Grain refinement • Cleaning and final packaging-Cleaned for use in vacuum Protection from environmental contaminants Protection during shipment |
Options • 99.99% minimum purity • Aluminum alloys sputtering targets Al2O3, Ni/Cr/Al/Si, Al/Nd, Y3Al5O12, In2O3/Al2O3/ZnO, Al/Si/Cu, Al/Cu, CuAlO2, AlN, Ni3/Al, Fe/Al, Al/Sc • Smaller sizes also available for R&D applications • Sputtering target bonding service |
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