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Silicon Sputtering Targets (Si)

Silicon Sputtering Targets (Si)
Material Type Silicon
Symbol Si
Atomic Weight 28.0855
Atomic Number 14
Color/Appearance Dark Gray with a Bluish Tinge, Semi-Metallic
Thermal Conductivity 150 W/m.K
Melting Point (°C) 1,410
Bulk Resistivity >1 OHM-CM, 0.005-0.020 OHM-CM, <0.1 OHM-CM
Coefficient of Thermal Expansion 2.6 x 10-6/K
Theoretical Density (g/cc) 2.32
Dopant Undoped, Boron, Phosphorous, Arsenic, or Antimony
Z Ratio 0.712
Sputter RF
Max Power Density*
(Watts/Square Inch)
20
Type of Bond Indium, Elastomer
Comments Alloys with W; use heavy W boat. SiO produced.

General

Silicon is a solid at room temperature, with a melting point of 1,414 °C (2,577 °F) and a boiling point of 3,265 °C (5,909 °F). Like water, it has a greater density in a liquid state than in a solid state and it expands when it freezes, unlike most other substances. With a relatively high thermal conductivity of 149 W•m-1•K-1, silicon conducts heat well.

Material Notes

Silicon Sputtering Targets, Purity is 99.999%; Circular: Diameter <= 14inch, Thickness >= 1mm; Block: Length <= 32inch, Width <= 12inch, Thickness >= 1mm. Bonding is recommended for these materials. Many materials have characteristics which are not amenable to sputtering, such as, brittleness and low thermal conductivity.This material may require special ramp up and ramp down procedures. This process may not be necessary with other materials. Targets that have a low thermal conductivity are susceptible to thermal shock.
 


Other Information of Silicon Sputtering Targets

Applications
Electronics
• Semiconductor
• Flat panel displays
Features
Competitive pricing
• High purity
• Grain refined, engineered microstructure
• Semiconductor grade

Manufacturing Process
Refining
  Three-layer electrolytic process
• Melting and casting
  Electrical resistance furnace - Semi-continuous casting
• Grain refinement
  Thermomechanical treatment
• Cleaning and final packaging - Cleaned for use in vacuum
  Protection from environmental contaminants
  Protection during shipment
Options
99.999% minimum purity
• Semiconductor grade aluminum alloys available
  Al/Si,Al/Cu,Al/Cu/Si
• Planar circular targets up to 18'' (457mm) diameter
• Planar tiles up to 48'' (1200mm) X 15.75'' (400mm) for larger target configurations
• Smaller sizes also available for R&D applications
• Sputtering target bonding service
 
 

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