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Tin Oxide Sputtering Targets (SnO2)

Tin Oxide Sputtering Targets (SnO2)
Material Type Tin Oxide
Symbol SnO2
Color/Appearance White or Gray, Crystalline Solid
Melting Point (°C) 1,630
Theoretical Density (g/cc) 6.95
Z Ratio **1.00
Sputter RF, RF-R
Max Power Density*
(Watts/Square Inch)
20
Type of Bond Elastomer
Comments Films from W are oxygen deficient; oxidize in air.

General

Tin dioxide (tin(IV) oxide), also known as stannic oxide, is the inorganic compound with the formula SnO2. The mineral form of SnO2 is called cassiterite, and this is the main ore of tin. With many other names, this oxide of tin is the most important raw material in tin chemistry. It is a colourless, diamagnetic, amphoteric solid.

Material Notes

Tin Dioxide Sputtering Target, Purity is 99.99%; Circular: Diameter <= 14inch, Thickness >= 1mm; Block: Length <= 32inch, Width <= 12inch, Thickness >= 1mm. Elastomer Bonding is recommended for these materials. Many materials have characteristics which are not amenable to sputtering, such as, brittleness and low thermal conductivity.
 



Other Information of Tin Oxide Sputtering Targets

Applications
  Ferroelectric
• Gate Dielectric

• For CMOS

Features
• High purity
• Custom Sizes Available

Manufacturing Process
• Manufacturing - Cold pressed - Sintered, Elastomer bonded to backing plate

• Cleaning and final packaging, Cleaned for use in vacuum,
Protection from environmental contaminants
Protection during shipment

Options
• 99.9% ex Strontium Minimum Purity

• Up to 12'' Diameter Targets Available

• Planar Tiles Up to 8'' X 5'' for Larger Target Configurations

 
 
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