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Tin Sputtering Targets (Sn)

Tin Sputtering Targets (Sn)
Material Type Tin
Symbol Sn
Atomic Weight 118.71
Atomic Number 50
Color/Appearance Silvery Lustrous Gray, Metallic
Thermal Conductivity 66.6 W/m.K
Melting Point (°C) 232
Coefficient of Thermal Expansion 22 x 10-6/K
Theoretical Density (g/cc) 7.28
Z Ratio 0.724
Sputter DC
Max Power Density*
(Watts/Square Inch)
10
Type of Bond Elastomer
Comments Wets Mo low sputter power. Use Ta liner in E-beam guns. Low Melting Point materials not ideal for sputtering.

General

Tin is a soft, malleable, ductile and highly crystalline silvery-white metal. When a bar of tin is bent, a crackling sound known as the "tin cry" can be heard from the twinning of the crystals.[6] Tin melts at the low temperature of about 232  ℃(450 ℉), the lowest in group 14. The melting point is further lowered to 177.3 ℃(351.1 ℉) for 11 nm par.

Material Notes

Tin Sputtering Targets, Purity is 99.99%;Circular: Diameter <= 14inch, Thickness >= 1mm; Block: Length <= 32inch, Width <= 12inch, Thickness >= 1mm.
 


Other Information of Tin Sputtering Targets

Applications
Electronics
• Semiconductor
• Flat panel displays
Features
Competitive pricing
• High purity
• Grain refined, engineered microstructure
• Semiconductor grade

Manufacturing Process
Refining
  Three-layer electrolytic process
• Melting and casting
  Electrical resistance furnace - Semi-continuous casting
• Grain refinement
  Thermomechanical treatment
• Cleaning and final packaging - Cleaned for use in vacuum
  Protection from environmental contaminants
  Protection during shipment
Options
99.999% minimum purity
• Semiconductor grade aluminum alloys available
  Al/Si,Al/Cu,Al/Cu/Si
• Planar circular targets up to 18'' (457mm) diameter
• Planar tiles up to 48''(1200mm) X 15.75''(400mm) for larger target configurations
• Smaller sizes also available for R&D applications
• Sputtering target bonding service
 
 
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