Tin Sputtering Targets (Sn)
| Material Type | Tin |
| Symbol | Sn |
| Atomic Weight | 118.71 |
| Atomic Number | 50 |
| Color/Appearance | Silvery Lustrous Gray, Metallic |
| Thermal Conductivity | 66.6 W/m.K |
| Melting Point (°C) | 232 |
| Coefficient of Thermal Expansion | 22 x 10-6/K |
| Theoretical Density (g/cc) | 7.28 |
| Z Ratio | 0.724 |
| Sputter | DC |
|
Max Power Density* (Watts/Square Inch) |
10 |
| Type of Bond | Elastomer |
| Comments | Wets Mo low sputter power. Use Ta liner in E-beam guns. Low Melting Point materials not ideal for sputtering. |
Tin Sputtering Targets
Tin is a soft, malleable, ductile, and highly crystalline silvery-white metal. When a bar of tin is bent, a crackling sound known as the "tin cry" can be heard from the crystals' twinning. Tin melts at the low temperature of about 232 ℃(450 ℉), the lowest in group 14. The melting point is further lowered to 177.3 ℃(351.1 ℉) for 11 nm par.
Tin Sputtering Targets Information
Tin Sputtering Targets
Purity: 99.99%;
Circular: Diameter <= 14 inch, Thickness >= 1mm;
Block: Length <= 32 inch, Width <= 12 inch, Thickness >= 1mm.
More Information on Tin Sputtering Targets
Applications• Electronics• Semiconductor • Flat panel displays |
Features• Competitive pricing• High purity • Grain refined, Engineered microstructure • Semiconductor grade |
Manufacturing Process• RefiningThree-layer electrolytic process • Melting and casting Electrical resistance furnace - Semi-continuous casting • Grain refinement Thermomechanical treatment • Cleaning and final packaging - Cleaned for use in vacuum Protection from environmental contaminants Protection during shipment |
Options• 99.99% minimum purity• Smaller sizes also available for R&D applications • Sputtering target bonding service |
Related Products of Tin Sputtering Targets
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Ceramic Sputtering Targets |
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|
Evaporation Materials |
Crucibles N/A |
Metal Powders Tin Powder |
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