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Zinc Tin Sputtering Targets (Zn/Sn 52/48 wt%)

Zinc Tin Sputtering Targets (Zn/Sn 52/48 wt%)
Material Type Zinc Tin
Symbol Zn / Sn, 52 / 48 wt%
Color/Appearance Metallic solid in various forms
Melting Point (°C) N/A
Density N/A
Water Solubility Insoluble
Sputter  
Type of Bond Indium, Elastomer
Comments  

General


The research describe the electrolytic deposition of Zn, Sn and Zn/Sn alloys from a solution of the metal chloride salts separately in urea and ethylene glycol/choline chloride based ionic liquids. It shows that the deposition kinetics and thermodynamics differ from the aqueous processes and that qualitatively different phases, compositions and morphologies are obtained for the metal coatings in the different ionic liquid systems.


Material Notes

Zinc Tin Sputtering Targets, Purity is 99.9%;Circular: Diameter <= 14inch, Thickness >= 1mm; Block: Length <= 32inch, Width <= 12inch, Thickness >= 1mm.

 


Other Information of Zinc Tin Sputtering Targets

Applications
 Semiconductor
• Chemical vapor deposition (CVD)
• Physical vapor deposition (PVD) display
Features
Competitive pricing
• High purity
• Grain refined, engineered microstructure
• Semiconductor grade

Manufacturing Process
Refining
  Three-layer electrolytic process
• Melting and casting
  Electrical resistance furnace - Semi-continuous casting
• Grain refinement
  Thermomechanical treatment
• Cleaning and final packaging - Cleaned for use in vacuum
  Protection from environmental contaminants
  Protection during shipment
Options
99.9% minimum purity
• Planar circular targets up to 18'' (457mm) diameter
• Planar tiles up to 48'' (1200mm) X 15.75'' (400mm) for larger target configurations
• Smaller sizes also available for R&D applications
• Sputtering target bonding service
 
 
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