Aluminum Nitride Sputtering Targets (AlN)
| Material Type | Aluminum Nitride |
| Symbol | AlN |
| Color/Appearance | Bluish White, Crystalline Solid |
| Melting Point (°C) | ~2,200 |
| Theoretical Density (g/cc) | 3.26 |
| Z Ratio | **1.00 |
| Sputter | RF-R |
|
Max Power Density* (Watts/Square Inch) |
20 |
| Type of Bond | Elastomer |
| Comments | Decomposes. Reactive evap in 10-3 T N2 with glow discharge. |
Aluminum Nitride Sputtering Targets
Aluminum Nitride Sputtering Targets Information
Aluminum Nitride Sputtering Targets
Purity: 99.5%;
Circular: Diameter <= 14 inch, Thickness >= 1mm;
Block: Length <= 32 inch, Width <= 12 inch, Thickness >= 1mm.
Elastomer Bonding is recommended for these materials. Many materials have characteristics that are not amenable to sputtering, such as brittleness and low thermal conductivity. This material may require special ramp up and ramp down procedures. This material may require a special ramp up and ramp down procedures. This process may not be necessary for other materials. Targets that have low thermal conductivity are susceptible to thermal shock.
More Information on Aluminum Nitride Sputtering Targets
Applications• Chemical Vapor Deposition (CVD)• Physical Vapor Deposition (PVD) • Semiconductor • Optical |
Features• High purity• Custom sizes available |
Manufacturing Process• Manufacturing - Cold pressed - Sintered, Elastomer bonded to backing plate
• Cleaning and final packaging, Cleaned for use in vacuum, |
Options
• 99.5% minimum purity
• Smaller sizes also available for R&D applications
• Sputtering target bonding service
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Related Products of Aluminum Nitride Sputtering Targets
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Evaporation Materials |
Crucibles Alumina Crucible |
Metal Powders Aluminium Powder |
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