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AEM Deposition

Indium Sputtering Targets (In)

Indium Sputtering Targets (In)
Indium Sputtering Targets (In)
Material Type Indium
Symbol In
Atomic Weight 114.818
Atomic Number 49
Color/Appearance Silvery Lustrous Gray, Metallic
Thermal Conductivity 82 W/m.K
Melting Point (°C) 157
Coefficient of Thermal Expansion 32.1 x 10-6/K
Theoretical Density (g/cc) 7.3
Z Ratio 0.841
Sputter DC
Type of Bond Elastomer
Comments Wets W and Cu. Use Mo liner. Low Melting Point materials not ideal for sputtering.


Indium is a chemical element with symbol In and atomic number 49. It is a post-transition metal that makes up 0.21 parts per million of the Earth's crust. Very soft and malleable, indium has a melting point higher than sodium and gallium, but lower than lithium and tin. Chemically, indium is similar to gallium and thallium, and it is largely intermediate between the two in terms of its properties.Indium is a minor component in zinc sulfide ores and is produced as a byproduct of zinc refinement. It is most notably used in the semiconductor industry, in low-melting-point metal alloys such as solders, in soft-metal high-vacuum seals, and in the production of transparent conductive coatings of indium tin oxide (ITO) on glass. Indium has no biological role, though its compounds are somewhat toxic when injected into the bloodstream. Most occupational exposure is through ingestion, from which indium compounds are not absorbed well, and inhalation, from which they are moderately absorbed.

Material Notes

Indium Sputtering Targets, Purity is 99.99- 99.9999%;Circular: Diameter <= 14inch, Thickness >= 1mm; Block: Length <= 32inch, Width <= 12inch, Thickness >= 1mm.

Other Information of Indium Sputtering Targets

• Semiconductor
• Flat panel displays
Competitive pricing
• High purity
• Grain refined, engineered microstructure
• Semiconductor grade

Manufacturing Process
  Three-layer electrolytic process
• Melting and casting
  Electrical resistance furnace - Semi-continuous casting
• Grain refinement
  Thermomechanical treatment
• Cleaning and final packaging - Cleaned for use in vacuum
  Protection from environmental contaminants
  Protection during shipment
99.99% minimum purity
• Smaller sizes also available for R&D applications
• Sputtering target bonding service
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