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Zirconium Sputtering Targets (Zr)

Zirconium Sputtering Targets (Zr)
Material Type Zirconium
Symbol Zr
Atomic Weight 91.224
Atomic Number 40
Color/Appearance Silvery White, Metallic
Thermal Conductivity 22.7 W/m.K
Melting Point (°C) 1,852
Coefficient of Thermal Expansion 5.7 x 10-6/K
Theoretical Density (g/cc) 6.49
Z Ratio 0.6
Sputter DC
Max Power Density*
(Watts/Square Inch)
Type of Bond Indium, Elastomer
Export Control (ECCN) 1C234
Comments Alloys with W. Films oxidize readily.


Zirconium is a chemical element with symbol Zr and atomic number 40. The name zirconium is taken from the name of the mineral zircon, the most important source of zirconium. The word zircon comes from the Persian word zargun , meaning "gold-colored". It is a lustrous, grey-white, strong transition metal that resembles hafnium and, to a lesser extent, titanium. Zirconium is mainly used as a refractory and opacifier, although small amounts are used as an alloying agent for its strong resistance to corrosion. Zirconium forms a variety of inorganic and organometallic compounds such as zirconium dioxide and zirconocene dichloride, respectively. Five isotopes occur naturally, three of which are stable. Zirconium compounds have no known biological role.

Material Notes

Zirconium Sputtering Targets, Purity is Zr+Hf 99.95%; Circular: Diameter <= 14inch, Thickness >= 1mm; Block: Length <= 32inch, Width <= 12inch, Thickness >= 1mm. This is an Export Controlled Material. Restrictions may apply.

Other Information of Zirconium Sputtering Targets

• Semiconductor
• Flat panel displays
Competitive pricing
• High purity
• Grain refined, engineered microstructure
• Semiconductor grade

Manufacturing Process
  Three-layer electrolytic process
• Melting and casting
  Electrical resistance furnace - Semi-continuous casting
• Grain refinement
  Thermomechanical treatment
• Cleaning and final packaging - Cleaned for use in vacuum
  Protection from environmental contaminants
  Protection during shipment
99.999% minimum purity
• Semiconductor grade aluminum alloys available
• Planar circular targets up to 18'' (457mm) diameter
• Planar tiles up to 48''(1200mm) X 15.75''(400mm) for larger target configurations
• Smaller sizes also available for R&D applications
• Sputtering target bonding service

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