Zirconium Sputtering Targets (Zr)
| Material Type | Zirconium |
| Symbol | Zr |
| Atomic Weight | 91.224 |
| Atomic Number | 40 |
| Color/Appearance | Silvery White, Metallic |
| Thermal Conductivity | 22.7 W/m.K |
| Melting Point (°C) | 1,852 |
| Coefficient of Thermal Expansion | 5.7 x 10-6/K |
| Theoretical Density (g/cc) | 6.49 |
| Z Ratio | 0.6 |
| Sputter | DC |
|
Max Power Density* (Watts/Square Inch) |
50 |
| Type of Bond | Indium, Elastomer |
| Export Control (ECCN) | 1C234 |
| Comments | Alloys with W. Films oxidize readily. |
Zirconium Sputtering Targets
Zirconium is a lustrous, grey-white, strong transition metal that resembles Hafnium and, to a lesser extent, Titanium. Zirconium is mainly used as a refractory and opacifier, although small amounts are used as an alloying agent for its strong corrosion resistance. The zirconium sputtering target is widely used in decorating coating, semiconductor, and optical coating areas.
Zirconium Sputtering Targets Information
Zirconium Sputtering Targets
Purity: Zr + Hf ≥ 99.4%, Zr + Hf = 99.95%, Hf < 300 ppm/4.5%;
Circular: Diameter <= 14 inch, Thickness >= 1mm;
Block: Length <= 32 inch, Width <= 12 inch, Thickness >= 1mm;
Targets Type: Planar sputtering target, Rotary sputtering target;
This is an Export Controlled Material. Restrictions may apply.
More Information on Zirconium Sputtering Targets
Applications• Decorative coating• Hardware tool coating • Semiconductor • Optical coating |
Features• Competitive pricing• High purity • Grain refined, Engineered microstructure (average grain size < 100 um) • Semiconductor grade |
Manufacturing Process• Melting• Analysis • Casting & Grain refinement Forging, Rolling, Annealing, Micrography, Machining Thermomechanical treatment • Cleaning and final packaging - Cleaned for use in vacuum Protection from environmental contaminants Protection during shipment |
Options• 99.4% minimum purity• Smaller sizes also available for R&D applications • Sputtering target bonding service |
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