Zirconium Carbide Sputtering Targets (ZrC)

1 H1 He 2

2 Li3 Be4 B5 C6 N7 O8 F9 Ne10

3 Na11 Mg12 Al13 Si14 P15 S16 Cl17 Ar18

4 K19 Ca20 Sc 21 Ti 22 V 23 Cr 24 Mn 25 Fe 26 Co 27 Ni 28 Cu 29 Zn 30 Ga31 Ge32 As33 Se34 Br35 Kr36

5 Rb37 Sr38 Y 39 Zr 40 Nb 41 Mo 42 Tc 43 Ru 44 Rh 45 Pd 46 Ag 47 Cd 48 In49 Sn50 Sb51 Te52 I53 Xe54

6 Cs55 Ba56 La57 Hf 72 Ta 73 W 74 Re 75 Os 76 Ir 77 Pt 78 Au 79 Hg 80 Tl81 Pb82 Bi83 Po84 At85 Rn86

7 Fr87 Ra88 Ac89 Rf 104 Db 105 Sg 106 Bh 107 Hs 108 Mt 109 Uun 110 Uuu 111 Uub 112 Uut113 Uuq114 Uup115 Uuh116 Uus117 Uuo118

8 Ce 58 Pr 59 Nd 60 Pm 61 Sm 62 Eu 63 Gd 64 Tb 65 Dy 66 Ho 67 Er68 Tm69 Yb70 Lu71

9 Th 90 Pa 91 U 92 Np 93 Pu 94 Am 95 Cm 96 Bk 97 Cf 98 Es 99 Fm100 Md101 No102 Lr103

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Oxide Evaporation Material

Compound Evaporation Material

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Home > Sputtering Targets > Carbide Targets > Zirconium Carbide Sputtering Targets (ZrC)

Zirconium Carbide Sputtering Targets (ZrC)

Material Type	Zirconium Carbide
Symbol	ZrC
Melting Point (°C)	3,540

Theoretical Density (g/cc)	6.73
Z Ratio	0.264
Sputter	RF
Type of Bond	Indium, Elastomer
Export Control (ECCN)	1C234

General

Zirconium carbide (ZrC) is an extremely hard refractory ceramic material, commercially used in tool bits for cutting tools. It is usually processed by sintering.

Zirconium

carbide

(ZrC)

films

were prepared by using two Ar+ beams to sputter a zirconium target and a graphite target separately, and a third Ar+ beam to simultaneously bombard the growing flim.

{Ar}^{+}

{Ar}^{+}

Material Notes

Zirconium Carbide Sputtering Target, Purity is 99.5%; Circular: Diameter <= 14inch, Thickness >= 1mm; Block: Length <= 32inch, Width <= 12inch, Thickness >= 1mm. Bonding is recommended for these materials. Many materials have characteristics which are not amenable to sputtering, such as, brittleness and low thermal conductivity.This material may require special ramp up and ramp down procedures. This process may not be necessary with other materials. Targets that have a low thermal conductivity are susceptible to thermal shock.

Other Information of Zirconium Carbide Sputtering Targets

Applications
• PVD and CVD display
• Semiconductor

• Optical

Features
• High purity
• Custom Sizes Available

Manufacturing Process
• Manufacturing - Cold pressed - Sintered, Elastomer bonded to backing plate

• Cleaning and final packaging, Cleaned for use in vacuum,
Protection from environmental contaminants
Protection during shipment

Options
• 99% Minimum Purity

• Up to 12'' Diameter Targets Available

• Planar Tiles Up to 8'' X 5'' for Larger Target Configurations