Zirconium Carbide Sputtering Targets (ZrC)
| Material Type | Zirconium Carbide |
| Symbol | ZrC |
| Melting Point (°C) | 3,540 |
| Theoretical Density (g/cc) | 6.73 |
| Z Ratio | 0.264 |
| Sputter | RF |
| Type of Bond | Indium, Elastomer |
| Export Control (ECCN) | 1C234 |
Zirconium Carbide Sputtering Targets
Zirconium carbide (ZrC) is an extremely hard refractory ceramic material, commercially used in tool bits for cutting tools. It is usually processed by sintering. Zirconium carbide (ZrC) films were prepared by using two Ar+ beams to sputter a zirconium target and a graphite target separately, and a third Ar+ beam to simultaneously bombard the growing flim.
Zirconium Carbide Sputtering Targets Information
Zirconium Carbide Sputtering Targets
Purity: 99.5%;
Circular: Diameter <= 14 inch, Thickness >= 1mm;
Block: Length <= 32 inch, Width <= 12 inch, Thickness >= 1mm.
Bonding is recommended for these materials. Many materials have characteristics that are not amenable to sputtering, such as brittleness and low thermal conductivity. This material may require a special ramp up and ramp down procedures. This process may not be necessary for other materials. Targets that have low thermal conductivity are susceptible to thermal shock.
Purity: 99.5%;
Circular: Diameter <= 14 inch, Thickness >= 1mm;
Block: Length <= 32 inch, Width <= 12 inch, Thickness >= 1mm.
Bonding is recommended for these materials. Many materials have characteristics that are not amenable to sputtering, such as brittleness and low thermal conductivity. This material may require a special ramp up and ramp down procedures. This process may not be necessary for other materials. Targets that have low thermal conductivity are susceptible to thermal shock.
More Information on Zirconium Carbide Sputtering Targets
Applications• PVD and CVD display• Semiconductor • Optical |
Features• High purity• Custom Sizes Available |
Manufacturing Process• Manufacturing - Cold pressed - Sintered, Elastomer bonded to backing plate
• Cleaning and final packaging, Cleaned for use in vacuum, |
Options
• 99.5% minimum purity
• Smaller sizes also available for R&D applications
• Sputtering target bonding service
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