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Titanium Sputtering Targets (Ti)

Titanium Sputtering Targets (Ti)
Material Type Titanium
Symbol Ti
Atomic Weight 47.867
Atomic Number 22
Color/Appearance Silvery Metallic
Thermal Conductivity 21.9 W/m.K
Melting Point (°C) 1,660
Coefficient of Thermal Expansion 8.6 x 10-6/K
Theoretical Density (g/cc) 4.5
Z Ratio 0.628
Sputter DC
Max Power Density*
(Watts/Square Inch)
50
Type of Bond Indium, Elastomer
Comments Alloys with W/Ta/Mo; evolves gas on first heating.

General

As a metal, titanium is recognized for its high strength-to-weight ratio. It is a strong metal with low density that is quite ductile (especially in an oxygen-freeenvironment),lustrous, and metallic-white in color. The relatively high melting point (more than 1,650℃ or 3,000℉ ) makes it useful as a refractory metal. It is paramagnetic and has fairly low electrical and thermal conductiv.

Material Notes

Titanium Sputtering Targets, Purity is 99.7% - 99.995%; Circular: Diameter <= 14inch, Thickness >= 1mm; Block: Length <= 32inch, Width <= 12inch, Thickness >= 1mm.
 


Other Information of Titanium Sputtering Targets

Applications
Electronics
• Semiconductor
• Flat panel displays
Features
Competitive pricing
• High purity
• Grain refined, engineered microstructure
• Semiconductor grade

Manufacturing Process
Refining
  Three-layer electrolytic process
• Melting and casting
  Electrical resistance furnace - Semi-continuous casting
• Grain refinement
  Thermomechanical treatment
• Cleaning and final packaging - Cleaned for use in vacuum
  Protection from environmental contaminants
  Protection during shipment
Options
99.995% minimum purity
• Semiconductor grade aluminum alloys available
  Al/Si,Al/Cu,Al/Cu/Si
• Planar circular targets up to 18'' (457mm) diameter
• Planar tiles up to 48''(1200mm) X 15.75''(400mm) for larger target configurations
• Smaller sizes also available for R&D applications
• Sputtering target bonding service
 
 

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