Titanium Sputtering Targets (Ti)
| Material Type | Titanium |
| Symbol | Ti |
| Atomic Weight | 47.867 |
| Atomic Number | 22 |
| Color/Appearance | Silvery Metallic |
| Thermal Conductivity | 21.9 W/m.K |
| Melting Point (°C) | 1,660 |
| Coefficient of Thermal Expansion | 8.6 x 10-6/K |
| Theoretical Density (g/cc) | 4.5 |
| Z Ratio | 0.628 |
| Sputter | DC |
|
Max Power Density* (Watts/Square Inch) |
50 |
| Type of Bond | Indium, Elastomer |
| Comments | Alloys with W/Ta/Mo; evolves gas on first heating. |
General
As a metal, titanium is recognized for its high strength-to-weight ratio. It is a strong metal with low density that is quite ductile (especially in an oxygen-freeenvironment),lustrous, and metallic-white in color. The relatively high melting point (more than 1,650℃ or 3,000℉ ) makes it useful as a refractory metal. It is paramagnetic and has fairly low electrical and thermal conductiv.
Material Notes
Titanium Sputtering Targets, Purity is 99.7% - 99.995%; Circular: Diameter <= 14inch, Thickness >= 1mm; Block: Length <= 32inch, Width <= 12inch, Thickness >= 1mm.
Other Information of Titanium Sputtering Targets
|
Applications • Electronics • Semiconductor • Flat panel displays |
Features • Competitive pricing • High purity • Grain refined, engineered microstructure • Semiconductor grade |
|
Manufacturing Process • Refining Three-layer electrolytic process • Melting and casting Electrical resistance furnace - Semi-continuous casting • Grain refinement Thermomechanical treatment • Cleaning and final packaging - Cleaned for use in vacuum Protection from environmental contaminants Protection during shipment |
Options • 99.995% minimum purity • Semiconductor grade aluminum alloys available Al/Si,Al/Cu,Al/Cu/Si • Planar circular targets up to 18'' (457mm) diameter • Planar tiles up to 48''(1200mm) X 15.75''(400mm) for larger target configurations • Smaller sizes also available for R&D applications • Sputtering target bonding service |
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