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AEM Deposition

Titanium Sputtering Targets (Ti)

Titanium Sputtering Targets (Ti)
Titanium Sputtering Targets (Ti)Titanium Sputtering Targets (Ti)
Material Type Titanium
Symbol Ti
Atomic Weight 47.867
Atomic Number 22
Color/Appearance Silvery Metallic
Thermal Conductivity 21.9 W/m.K
Melting Point (°C) 1,660
Coefficient of Thermal Expansion 8.6 x 10-6/K
Theoretical Density (g/cc) 4.5
Z Ratio 0.628
Sputter DC
Max Power Density*
(Watts/Square Inch)
50
Type of Bond Indium, Elastomer
Comments Alloys with W/Ta/Mo; evolves gas on first heating.

General

Titanium is a strong metal with low density that is quite ductile (especially in an oxygen-freeenvironment). The relatively high melting point (more than 1,650℃ or 3,000℉ ) makes it useful as a refractory metal. It is paramagnetic and has fairly low electrical and thermal conductive. Titanium sputtering targets are common used in hardware tool coating, decorative coating, semicondutor components and Flat display coating. It is one of the core materials for preparing integrated circuits, and the purity usually require over 99.99%. AEM also can provide Titanium alloy targets such as tungsten titanium (W/Ti 90/10 wt%) sputtering target, which is an improtant material for semiconductor and solar industry. The density of W/Ti sputtering target we can reach over 14.24 g/cm3, and the purity can reach to 99.995%.

Material Notes

Purity: 99.9-99.999%
Circular: Diameter <= 14inch, Thickness >= 1mm
Block: Length <= 32inch, Width <= 12inch, Thickness >= 1mm
Targets Type: Planar sputtering target, Rotary sputtering target

Analysis of Titanium Sputtering Targets

AEM Deposition manufacture titanium sputtering targets with high purity, the highest purity can reach to 99.999%. The analytical methods we use includes:

1. Metallic elements were analyzed using ICP-OES.
2. Gas elements were analyzed using LECO.
 


Other Information of Titanium Sputtering Targets

Applications
 Decorative coating 
• Hardware tool coating
 Semiconductor
• Flat panel displays
Features
Competitive pricing
• High purity
• Grain refined, engineered microstructure
(Average grain size < 20 um)
• Semiconductor grade

Manufacturing Process
Melting (EB-Electron Beam Melting)
• Analysis
• Casting & Grain refinement
 
Forging, Rolling, Annealing, Micrography, Machining
• Cleaning and final packaging - Cleaned for use in vacuum
  Protection from environmental contaminants
  Protection during shipment
Options
99.5% minimum purity
• Semiconductor grade titanium alloys available
  Ti/Al, W/Ti 90/10 wt%)
• Smaller sizes also available for R&D applications
• Sputtering target bonding service
 
 

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